Patents by Inventor Jae Wan Koh

Jae Wan Koh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a metallic barrier layer in semiconductor device
    Patent number: 5877031
    Abstract: The present invention relates to a method for forming a TiNO metallic barrier layer acting as a diffusion barrier to intercept the diffusing of the Si atoms between metal layers, the method comprising the steps of: forming a TiN film through a sputtering equipment using Ar and N.sub.2 gas; implanting N.sub.2 O gas on the upper part of the TiN film; and annealing the resulting structure at N.sub.2 atmosphere for diffusing oxygen ions, thereby forming said resulting structure into uniform TiNO film.
    Type: Grant
    Filed: July 7, 1995
    Date of Patent: March 2, 1999
    Assignee: Hyundai Electronics Industries Co, Ltd
    Inventors: Hyun Jin Jang, Woo Bong Lee, Young Hwa Mun, Young Ho Jeon, Jae Wan Koh, Young Mo Koo, Se Jeong Kim
  • High voltage cut-off semiconductor device
    Patent number: 5640036
    Abstract: The present invention discloses a high voltage cut-off semiconductor device that can prevent unstable supply voltage of several volts that is not cut off by a conventional electrostatic discharge protection circuit from being applied to an internal circuit and apply only stable supply voltage to the internal circuit, thereby enhancing the characteristics of the semiconductor device and shortening the channel length of the transistors forming the internal circuit by suing a constant voltage circuit having a zener diode.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: June 17, 1997
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventors: Woo Bong Lee, Taek Ki Hong, Tae Jung Yeo, Jae Wan Koh, Se Jeong Kim