Patents by Inventor Jae-Wung BAE

Jae-Wung BAE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210222274
    Abstract: The present invention introduces a high entropy alloy doped with boron, comprising four or more metals selected from iron (Fe), chromium (Cr), nickel (Ni), cobalt (Co), manganese (Mn), molybdenum (Mo), aluminum (Al) and copper (Cu), and boron (B) which has single phase FCC structure.
    Type: Application
    Filed: November 7, 2017
    Publication date: July 22, 2021
    Inventors: Hyoung Seop KIM, Jae Bok SEOL, Jae Wung BAE, Jong Chan HAN
  • Publication number: 20210054486
    Abstract: Disclosed is a medium-entropy alloy, which is further improved in cryogenic mechanical properties of an existing FCC-based high-entropy alloy and is capable of ensuring price competitiveness, the medium-entropy alloy including 6 to 15 at % of Cr, 50 to 64 at % of Fe, 13 to 25 at % of Co, 13 to 25 at % of Ni, and the remainder of inevitable impurities, wherein the medium-entropy alloy includes a metastable FCC phase, whereby deformation-induced phase transformation from an FCC phase into a BCC phase occurs upon plastic deformation of the alloy, thus manifesting excellent cryogenic mechanical properties.
    Type: Application
    Filed: August 28, 2017
    Publication date: February 25, 2021
    Inventors: Hyoung-Seop KIM, Jong-Un MOON, Jae-Wung BAE