Abstract: An image sensor module is provided. The image sensor module includes a printed circuit board (PCB), an image sensor chip disposed on a first plane of the PCB and electrically connected to the PCB, and an image signal processing chip disposed on the first plane of the PCB and electrically connected to the PCB. An aspect ratio of the image signal processing chip is at least two times greater than an aspect ratio of the image sensor chip. A minimum feature size of a metal line implemented in the image sensor chip is at least 1.5 times greater than a minimum feature size of a metal line implemented in the image signal processing chip.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: The present invention relates to a lighting control system with a security function based on a CPTED, which is capable of acquiring detailed video information on a desired object in interlocking with a video device such as a DVR based on sensing information collected through sensors included a local lighting device and controlling a lighting adjacent to the object to strengthen a security function. Since lightings and cameras can be simultaneously controlled to direct a suspicious object in response to motion of the suspicious object without any separate video analysis module, the object's crime intention can be prevented and the object's video can be acquired without any shadow zone or deteriorated video quality, which can result in increased security in interlocking of the security function including CPTED-based crime prevention with the lighting control.

Abstract: The present invention relates to a lighting control system with a security function based on a CPTED, which is capable of acquiring detailed video information on a desired object in interlocking with a video device such as a DVR based on sensing information collected through sensors included a local lighting device and controlling a lighting adjacent to the object to strengthen a security function. Since lightings and cameras can be simultaneously controlled to direct a suspicious object in response to motion of the suspicious object without any separate video analysis module, the object's crime intention can be prevented and the object's video can be acquired without any shadow zone or deteriorated video quality, which can result in increased security in interlocking of the security function including CPTED-based crime prevention with the lighting control.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: The present invention relates to a light control system using statement of Personal Computer (PC) which is applied to a building for energy saving and method thereof, and more specifically, to a light control system, in which a lighting environment is changed depending on a PC operation state to provide the lighting environment optimized for a working environment and that uses a PC state and is applied to a building for energy saving in order to promote energy saving effects, and a method thereof. According to the invention, a worker's attending and leaving states and being temporarily away from his or her position are easily determined using a PC operation state and thus a light illumination intensity is adaptively adjusted. As a result, it is possible to improve energy saving effects and optimize the lighting environment.

Abstract: Disclosed herein are diagnostic markers for lung cancer, isolated from serum glycoproteins. The disclosed diagnostic markers for lung cancer are specifically expressed only in the sera of lung cancer patients at high levels, and thus will be very useful for diagnosing lung cancer and estimating disease progression and treatment.

Abstract: A method of fabricating a semiconductor package includes providing a wafer which includes an upper area having through silicon vias (TSVs) and a lower area not having the TSVs; mounting a semiconductor chip on the upper area of the wafer; forming a passivation layer to a predetermined thickness to cover the semiconductor chip; exposing the TSVs by removing the lower area of the wafer in a state where no support is attached to the wafer; and exposing a top surface of the semiconductor chip by partially removing the passivation layer.

Abstract: A semiconductor device defect detecting apparatus including: a sensor disposed on semiconductor process equipment, the sensor configured to detect a signal emitted from a semiconductor device in contact with the semiconductor process equipment; and a signal analyzer configured to determine whether the semiconductor device is defective based on the detected signal in a predetermined frequency range.

Abstract: A refrigerator includes a hinge bracket that is installed on a cabinet between an upper door and a lower door, which are configured to individually open and close an upper portion and a lower portion of a cabinet, respectively, and rotatably supports the upper door and the lower door, the hinge bracket coupled to a connecting member through a reinforcing bracket, which is installed at an inner side of a wall forming a heat insulation space of the cabinet, thereby enhancing the sealing performance of a filler unit configured to seal between the upper door and the lower door.

Abstract: The present invention relates to a recombinant adenovirus expressing an ?A-crystallin gene, and gene therapy for retinal vascular disease using the recombinant adenovirus. Gene therapy using the recombinant adenovirus comprising an ?A-crystallin gene of the present invention increases the expression level of the ?A-crystallin gene in the damaged retinal pericytes to suppress pericyte loss and death, retinal vascular leakage, and leukocyte adhesion surrounding retinal vessels, thereby protecting the pericytes. Therefore, it can be used for the prevention and treatment of various retinal vascular diseases including diabetic retinopathy.

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate, a plurality of semiconductor chips, and a plurality of connection terminals. The package substrate includes a center portion, which has a first recess with a portion of a top of the package substrate removed, and an edge portion that has a plurality of second recesses. Each second recess has a portion of a bottom of the package substrate removed. The plurality of semiconductor chips are mounted in the first recess, and the plurality of connection terminals are respectively disposed in the second recesses.

Abstract: A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid molding resin may include powdered molding resin or sheet-type molding resin. In a case where liquid molding resin is coated on the top surface of the semiconductor chip, the substrate is mounted between a lower molding and an upper molding, and then melted molding resin is filled in a space between the lower molding and the upper molding. In a case where the solid molding resin is disposed on the top surface of the semiconductor chip, the substrate is mounted on a lower mold and then the solid molding resin is heated and melts into liquid molding resin having flowability. An upper mold is mounted on the lower mold, and melted molding resin is filled in a space between the lower molding and the upper molding.

Abstract: Disclosed herein are diagnostic markers for lung cancer, isolated from serum glycoproteins. The disclosed diagnostic markers for lung cancer are specifically expressed only in the sera of lung cancer patients at high levels, and thus will be very useful for diagnosing lung cancer and estimating disease progression and treatment.

Abstract: A refrigerator includes a hinge bracket that is installed on a cabinet between an upper door and a lower door, which are configured to individually open and close an upper portion and a lower portion of a cabinet, respectively, and rotatably supports the upper door and the lower door, the hinge bracket coupled to a connecting member through a reinforcing bracket, which is installed at an inner side of a wall forming a heat insulation space of the cabinet, thereby enhancing the sealing performance of a filler unit configured to seal between the upper door and the lower door.

Abstract: Disclosed herein is a system and method for providing a packet network-based MRBT service. In the method, when an originating MSC (110) requests call termination location information from an HLR (120), the HLR transmits an MRBT service request message, including a calling number and a called number, to an MRBT server (140). The MRBT server returns an MRBT service response message, including URL of MRBT content, to the HLR. The HLR transmits a call termination location information response message to the originating MSC, with MRBT service ID information and called party MRBT content URL information included in the call termination location information response message. The originating MSC (110) transmits called party MRBT content URL information to an originating MS (100) on a basis of the MRBT service ID information. The originating MS accesses the MRBT content URL, downloads relevant MRBT content, and plays and stores the MRBT content.

Abstract: A battery charging device includes a power terminal unit to be connected to a power source and provided with power therefrom, a charging terminal unit to be connected to a power terminal of a battery, and a holding device to be fixed to side faces of the battery when the charging terminal unit contacts the power terminal of the battery.

Abstract: An apparatus to manufacture a semiconductor package is provided. A die attaching process and/or a wire bonding process for first and second surfaces of a lead frame are sequentially performed inside the apparatus. Thus, time required for a semiconductor packaging process decreases and yield is increased.