Abstract: Disclosed is an electronic device capable of automatically identifying a workout environment, such as a swimming pool environment or outdoor environment, based on position-associated information of the electronic device and providing workout information per the workout environment.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: A glucagon-like peptide-2 (GLP-2) derivative, a conjugate thereof, and a use thereof are disclosed. Additionally, a method for preparing a glucagon-like peptide-2 (GLP-2) derivative and a conjugate thereof is disclosed.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: An authentication method includes projecting a near infrared (NIR) ray using a light emitting diode (LED) of a terminal, receiving a light reflected by a vein of a user using an image sensor of the terminal, verifying whether an image generated using the received light exhibits a vein pattern, in response to the image generated using the received light being verified as exhibiting the vein pattern, generating a vein pattern of the vein based on an image generated using the received light, and in response to the generated vein pattern being determined to match a pre-stored vein pattern, authenticating the user as a registered user corresponding to the pre-stored vein pattern.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: An image sensor for simultaneously obtaining an image and a proximity is provided. The image sensor includes a proximity signal generating circuit configured to generate a proximity signal of a target based on a pixel signal of a pixel array. The proximity signal generating circuit generates the proximity signal based on an average of pixel signals output from a plurality of pixels included in the pixel array.

Abstract: Disclosed are an electric vehicle capable of improving the charging efficiency of a charging apparatus by reducing the switching loss that may occur in the charging apparatus of an electric vehicle and a charging apparatus thereof. To this end, a power factor correction apparatus of an on board charger includes a first boost circuit receiving AC power through a first inductor to charge a load, a second boost circuit receiving the AC power through a second inductor to charge the load, and a third inductor provided between a leg of the first boost circuit and a leg of the second boost circuit so that parasitic capacitors of the first boost circuit and the second boost circuit are discharged.

Abstract: A beam steering apparatus, a method of driving the beam steering apparatus, and a spatial information acquisition apparatus using the beam steering apparatus, are provided. The beam steering apparatus includes a light source, and a steering array including elements having refractive indexes varying with a voltage driving the steering array, the elements being configured to control a direction of a beam from the light source and incident on the steering array. The beam steering apparatus further includes a driver configured to generate the voltage, based on an intermediate value of at least two voltages, and drive the steering array, based on the generated voltage.

Abstract: An authentication method includes projecting a near infrared (NIR) ray using a light emitting diode (LED) of a terminal, receiving a light reflected by a vein of a user using an image sensor of the terminal, verifying whether an image generated using the received light exhibits a vein pattern, in response to the image generated using the received light being verified as exhibiting the vein pattern, generating a vein pattern of the vein based on an image generated using the received light, and in response to the generated vein pattern being determined to match a pre-stored vein pattern, authenticating the user as a registered user corresponding to the pre-stored vein pattern.

Abstract: A semiconductor packaging apparatus and methods of manufacturing semiconductor devices using the same. The semiconductor packaging apparatus includes a process unit, and a controller associated with the process unit. The process unit includes a bonding part that bonds a semiconductor substrate and a carrier substrate to each other to form a bonded substrate, a cooling part that cools the bonded substrate, and a detection part in the cooling part and configured to detect a defect of the bonded substrate. The controller is configured to control the process unit using data obtained from the detection part.

Abstract: A method and apparatus for authenticating a user using a vein pattern are provided that project a near infrared (NIR) ray toward a skin of the user using a light emitting diode (LED), where the user is adjacent to a terminal including the LED. An image sensor receives a light reflected by the skin, generates a vein pattern of the skin based on an image generated using the received light, and authenticates the user as a registered user of a pre-stored vein pattern when the generated vein pattern matches the pre-stored vein pattern.

Abstract: A depth sensor and a 3D camera include a macro pixel that provides an output signal when light is received and a programmable concurrent detector (PCD) circuit that compares an electric signal provided by the macro pixel with a number of concurrence (NC) and determines a necessity of providing the output signal of the macro pixel. In addition, the depth sensor and the 3D camera may include a controller that measures a dark count of the macro pixel, changes the number of concurrence (NC) of the macro pixel, based on the dark count, and controls noise of the macro pixel. In addition, the depth sensor and the 3D camera may control the noise of the macro pixel, based on an external light count which is a noise signal generated due to the external light.

Abstract: The magnetic coil driving circuit of the magnetic contactor according to the present invention comprises a semiconductor switch configured to open or close a circuit for magnetizing or demagnetizing a magnetic coil; a pulse width modulation unit configured to output a pulse signal as a control signal for turning on or off the semiconductor switch; a control unit configured to output a control signal for changing a pulse width of the pulse signal to the pulse width modulation unit; and a temperature detection and protection unit configured to detect a temperature inside the magnetic contactor, output an output signal for turning off the semiconductor switch when the temperature exceeds an allowable temperature, and control the semiconductor switch by the pulse signal from the pulse width modulation unit when the temperature is within the allowable temperature.

Abstract: The present invention relates to an enclosed type electromagnetic switch having a status indication function, and more particularly, to and enclosed-type electromagnetic switch having a status indication function that can show the electromagnetic switch's status on an enclosure.

Abstract: A semiconductor device includes a substrate with an opening formed through the substrate. A first electronic component is disposed over the substrate outside a footprint of the first opening. A second electronic component is disposed over the substrate opposite the first electrical component. A third electronic component is disposed over the substrate adjacent to the first electronic component. The substrate is disposed in a mold including a second opening of the mold over a first side of the substrate. The mold contacts the substrate between the first electronic component and the third electronic component. An encapsulant is deposited into the second opening. The encapsulant flows through the first opening to cover a second side of the substrate. In some embodiments, a mold film is disposed in the mold, and an interconnect structure on the substrate is embedded in the mold film.

Abstract: According to one embodiment of the present invention, a method is disclosed for calculating the route of a journey (trip) identified by an origin and a destination using traffic information on a terminal, wherein the method comprises the steps of: receiving updated traffic information relating to a first route, while the terminal or a moving object on which the terminal is mounted is running on the first route; calculating a second route by using the updated traffic information; and transmitting, to a server, an entire route or a partial route of the calculated second route.

Abstract: A CMOS imaging sensor with embedded feature extraction capability operatable in different modes by a method that includes the steps of: (a) operating the CMOS imaging sensor in a motion-detecting mode at a first power level using circuitry on the imaging sensor that generates motion data based on received images detected by pixels in the pixel array; (b) switching the imaging sensor from the motion-detecting mode to a feature extraction mode in response to detecting motion; and (c) operating the imaging sensor in the feature extraction mode at a second power level that is higher than the first power level.

Abstract: A method for transferring a route of a trip identified by departure and destination which are calculated by a server to a third terminal, according to one embodiment of the present invention, is performed by a terminal, and the departure is a position of the third terminal defined as an identifier (Id) of the third terminal, and the destination is a current position of the terminal.

Abstract: A DC-DC converter includes: a clamp capacitor having one terminal connected with a ground terminal of a voltage source; a switching circuit including first and second switches connected with each other in series between a positive terminal and the ground terminal of the voltage source, and third and fourth switches connected with each other in series between both terminals of the clamp capacitor; and a forward-flyback transformer including a plurality of primary coils connected between a first connection node between the first and second switches and a second connection node between the third and fourth switches.