Abstract: An internal reference voltage generation device may include a cell array including a plurality of cells which provide reference voltages of different levels. Each of the plurality of cells may include one of a plurality of divider resistors included in a resistor string; a transmission gate configured to output a voltage of a divider node which is connected to the one divider resistor, in response to a select signal; and a unit decoder configured to provide the select signal to the transmission gate.

Abstract: A systems and methods for tracking a position of an electrode. The system may include: a notching controller configured to store pitch information of a unit electrode and to acquire electrode coordinate information of the electrode in a roll-to-roll state during a notching process and a cell identification (ID) of the unit electrode; a calculator configured to calculate coordinates of the cell ID from the pitch information and the cell ID; a roll map generator configured to generate a roll map based on the electrode coordinate information transmitted from the notching controller; and a mapping part configured to compare the coordinates of the roll map with the coordinates of the cell ID to derive an electrode position of the electrode during the electrode manufacturing process from which the unit electrode originates.

Abstract: A dual release actuator for a vehicle seat includes a motor, a cable carrier configured to receive power of the motor, thereby rotating to selectively pull one of two different cables, a Hall sensor to sense rotation of the motor, and a controller configured to count a sensing pulse of the Hall sensor for controlling rotation of the motor.

Abstract: An apparatus for generating a roll map of a merge-wound electrode includes a position measurement device configured to acquire coordinate value data for a longitudinal position of an electrode according to an amount of rotation of the rewinder. The apparatus includes an input device configured to input an input signal indicating a start of merge-winding or an end of merge-winding, a seam detector configured to detect a seam, a reference point detector configured to detect a plurality of reference points of the merge-wound electrode, and a roll map generator configured to generate a roll map for simulating the merge-wound electrode moving in a roll-to-roll state based on the input signal of the input device, and to display the longitudinal coordinate values of the electrode, the electrode coordinate values of the seam, and the electrode coordinate values of the plurality of reference points of the merge-wound electrode on the roll map.

Abstract: Methods and systems for executing tracking and monitoring manufacturing data of a battery are disclosed. One method includes: receiving, by a server system, sensing data of the battery from a sensing system; generating, by the server system, mapping data based on the sensing data; generating, by the server system, identification data of the battery based on the sensing data; generating, by the server system, monitoring data of the battery based on the sensing data, the identification data, and the mapping data; and generating, by the server system, display data for displaying a simulated electrode of the battery on a graphical user interface based on the monitoring data of the battery.

Abstract: The present invention relates to a photosensitive transfer resin, an LED chip transfer method, and a method for manufacturing a display device, to which are applied a technique for etching and separating LED chips formed on a wafer and transferring each of the separated chips to a carrier substrate, and a technique for using the photosensitive transfer resin to selectively transfer a portion of each of the chips transferred to the carrier substrate to another carrier substrate and a display panel in succession or at intervals. A photosensitive transfer resin for transferring an LED chip according to an embodiment of the present invention is prepared by mixing a photosensitive resin and a photoactive agent solution obtained by mixing a solvent and a photoactive agent powder. The photosensitive transfer resin can be expanded by heating without a development process following exposure, and thereby be used for peeling or transferring LED chips adhered to the photosensitive transfer resin.

Abstract: The present invention relates to a transfer technology using a technique of transferring LED chips formed on a wafer to another carrier substrate and display panel, a transfer resin, and an apparatus for transferring an LED chip and a display panel using a resin which expands when light is applied. An apparatus for transferring an LED chip in accordance with an embodiment of the present invention, comprises: a substrate and a resin layer, formed on the substrate, which forms a photo-deteriorating layer and expands at a predetermined temperature. An LED chip is disposed on the resin layer and a lower part of the LED chip is placed in a state of being embedded in the resin layer by a clip-up structure. An adhesive force of the LED chip located in the photo-deteriorating layer is offset so that the LED chip is peeled off or transferred.

Abstract: The present invention provides a LED chip scale package, comprising: a light emitting diode chip having a pad electrically connected to an external object on one side thereof, a phosphor silicon film surrounding the light emitting diode chip so that a bonding surface of the pad is exposed to an outside, and a metal layer connected to the bonding surface and expanding a surface area of the pad, and a method for manufacturing the same.

Abstract: The present invention provides a round chip scale package comprising: a light emitting diode for providing blue light from a side surface and an upper surface thereof; and a three-dimensional fluorescent layer arranged to encompass the side surface and the upper surface of the light emitting diode, thereby converting the blue light emitted from the side surface and the upper surface of the light emitting diode into white light, wherein the three-dimensional fluorescent layer comprises a phosphor and silicon, and an edge region of the three-dimensional fluorescent layer is formed into a round shape.

Abstract: Provided are a manufacturing method of mass-producing a nano or micro color conversion light emitting diode by a photolithography process, and a nano or micro color conversion light emitting diode manufactured therefrom.

Abstract: The present invention provides a round chip scale package comprising: a light emitting diode for providing blue light from a side surface and an upper surface thereof; and a three-dimensional fluorescent layer arranged to encompass the side surface and the upper surface of the light emitting diode, thereby converting the blue light emitted from the side surface and the upper surface of the light emitting diode into white light, wherein the three-dimensional fluorescent layer comprises a phosphor and silicon, and an edge region of the three-dimensional fluorescent layer is formed into a round shape.

Abstract: The present invention relates to an apparatus for manufacturing fluorescent layers and, more particularly, to an apparatus for manufacturing fluorescent layers, which converts light from a light-emitting diode into white light by varying a wavelength of the light emitted from the light-emitting diode. The present invention provides the apparatus for manufacturing fluorescent layers includes a vertical frame and a fluorescent layer pattern hole formed in a direction vertical to the vertical frame in a fluorescent layer pattern form within the vertical frame.

Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.

Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.

Abstract: The present invention provides a light-emitting diode (LED) package including: a substrate on which a set of bonding pads are formed; an LED element configured to provide light of a predetermined wavelength region, having a set of chip pads formed on a top surface thereof and being attached on a top surface of the substrate; a set of gold wires connecting the bonding pads of the substrate with the chip pads of the LED element; a phosphor layer formed in a cap shape having side and top portions of a uniform thickness and being configured to surround sides and a top surface of the LED element while being spaced apart therefrom; and a filler disposed to fill a space formed between the phosphor layer and the LED element, wherein the LED element, the gold wires, and the bonding pads of the substrate are under the phosphor layer cap.

Abstract: Disclosed herein is a light-emitting diode (LED) package in accordance with an embodiment of the present invention, which includes an LED configured to provide light of a wavelength having a specific region, a circuit board electrically connected to the LED through bonding pads formed at the bottom of the LED, a phosphor layer formed as a cap, disposed to surround sides and a top of the LED, and configured to have sides and top thereof formed to a uniform thickness, and a buffer layer disposed between the top of the LED and a bottom of the phosphor layer and configured to suppress heat, generated from the top of the LED, from being transferred to the bottom of the phosphor layer and to prevent a bottom of the phosphor layer from being deviated from the top of the LED.

Abstract: Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner.

Abstract: Disclosed herein is a method of disposing phosphor layers, which can prevent damage to phosphors and also effectively dispose phosphor layers at desired locations of Light-Emitting Diodes (LEDs) when the phosphor layers are detached and disposed at the top surfaces of the LEDs. According to an embodiment, phosphor layers fabricated by filling phosphor layer pattern holes within an area of the vertical frame with a phosphor solution are detached from the phosphor layer pattern holes by applying force downwardly or upwardly in a vertical manner.

Abstract: The present invention relates to an apparatus for manufacturing fluorescent layers and, more particularly, to an apparatus for manufacturing fluorescent layers, which converts light from a light-emitting diode into white light by varying a wavelength of the light emitted from the light-emitting diode. The present invention provides the apparatus for manufacturing fluorescent layers includes a vertical frame and a fluorescent layer pattern hole formed in a direction vertical to the vertical frame in a fluorescent layer pattern form within the vertical frame.