Abstract: A method for testing a microelectronic circuit to detect process defects which affect first and second characteristics of the circuit elements thereof. The circuit is formed on a semiconductor chip in proximity with an independent test element. The test element is not connected to and does not form a part of the circuit. The circuit elements are tested to detect process defects which affect the first characteristic thereof. The test element is tested to detect process defects which affect the second characteristics of both the circuit elements and the test element. The results of the test on the test element are relied on to determine the acceptability of the second characteristics of the circuit elements. The test on the test element for said second characteristic may be performed at the same time the circuit elements are being tested for said first characteristic.