Abstract: The invention relates to an image sensing device and an image sensing method thereof. The image sensing device includes: an image sensing array and an image processing circuit. The image sensing array generates multiple pixel data, and the pixel data includes a first pixel data and a second pixel data. The first pixel data is generated by exposing for a first exposure time, the second pixel data is generated by exposing for a second exposure time, and the first exposure time is shorter than the second exposure time. The image processing circuit executes an automatic exposure convergence operation with the first pixel data to generate new exposure parameters for the automatic exposure convergence operation. The second exposure time is adjusted according to the new exposure parameters, so that the second pixel data is pixel data with changed exposure time.

Abstract: Disclosed are an image sensor and an image sensing method. The image sensor includes a first pixel circuit. The first pixel circuit includes a first driving transistor, a first selection transistor, a first transfer transistor, a first reset transistor and a first sensing unit. A control terminal of the first selection transistor is used for receiving a first selection signal. A control terminal of the first transmitting transistor is used for receiving a first transmitting signal. The image sensing method includes the following steps: receiving a first reset signal during a reset period through a control terminal of the first reset transistor; and receiving a first ramp signal during a sensing period through a control terminal of the first reset transistor.

Abstract: A driver chip is provided. The driver chip includes a light-emitting module and a wafer substrate. The light-emitting module has multiple pins. The wafer substrate has a first surface and a second surface. The wafer substrate includes a photodiode, an image sensing circuit, and a light-emitting driving circuit. The photodiode is disposed on the second surface of the wafer substrate. The image sensing circuit is disposed in the wafer substrate and is electrically connected to the photodiode to drive the photodiode. The light-emitting driving circuit is disposed in the wafer substrate, and is electrically connected to the multiple pins of the light-emitting module via multiple connection units on the first surface of the wafer substrate to drive the light-emitting module.

Abstract: Disclosed are a chip with automatic clock signal correction and an automatic correction method. The chip includes a transmission interface, an oscillator and a correction logic circuit. The transmission interface provides a first clock signal. The oscillator generates a second clock signal. The correction logic circuit is coupled to the oscillator and the transmission interface, and performs correction operation to count the first clock signal to generate a first clock count value, and count the second clock signal to generate a second clock count value. When the first clock count value is equal to the first count target value, the correction logic circuit stops counting, and calculates a correction value based on the second clock count value and the second count target value. The correction logic circuit outputs the correction value to the oscillator, and the oscillator corrects a frequency of the second clock signal according to the correction value.