Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

Abstract: A method of forming an ultrasonic transducer device includes forming a curved membrane over a transducer cavity. A center portion of the curved membrane is closer to a bottom surface of the transducer cavity than with respect to radially outwardly disposed portions of the curved membrane.

Abstract: A universal ultrasound device having an ultrasound includes a semiconductor die; a plurality of ultrasonic transducers integrated on the semiconductor die, the plurality of ultrasonic transducers configured to operate a first mode associated with a first frequency range and a second mode associated with a second frequency range, wherein the first frequency range is at least partially non-overlapping with the second frequency range; and control circuitry configured to: control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the first frequency range, in response to receiving an indication to operate the ultrasound probe in the first mode; and control the plurality of ultrasonic transducers to generate and/or detect ultrasound signals having frequencies in the second frequency range, in response to receiving an indication to operate the ultrasound probe in the second mode.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: The disclosed embodiments relate to a capacitive micromachined transducers for ultrasound imaging having pressure calibrator to compensate for ultrasound image distortions caused by environmental pressure changes. In one embodiment, the disclosure relates to a method to calibrate a first ultrasound transducer of an array of ultrasound transducers for ambient pressure variation. The method includes the steps of detecting a real-time ambient pressure value; determining a pressure difference value between the detected ambient pressure value and a predetermined pressure value; and calibrating the first ultrasound transducers to compensate for the determined pressure difference.

Abstract: An ultrasound imaging device includes an ultrasound transducer module disposed within a housing and a flowable acoustic damping material disposed on at least one surface located within an interior of the housing. The flowable acoustic damping material may be a Teflon-containing gel material, in contact with at least one internal surface of the imaging device to provide acoustic damping.

Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

Abstract: An ultrasound-on-a-chip device has an ultrasonic transducer substrate with plurality of transducer cells, and an electrical substrate. For each transducer cell, one or more conductive bond connections are disposed between the ultrasonic transducer substrate and the electrical substrate. Examples of electrical substrates include CMOS chips, integrated circuits including analog circuits, interposers and printed circuit boards.

Abstract: The disclosed embodiments relate to a portable ultrasound device. Specifically, the disclosed embodiments relate to an acoustic lens positioned at an ultrasound probe. The acoustic lens may be configured for impedance matching and signal attenuation. In one embodiment, ultrasound signal attenuation is provided by forming an acoustic lens as a solid admixture of signal attenuating particles in a polymer matrix.

Abstract: The disclosed embodiments relate to a portable ultrasound device. Specifically, the disclosed embodiments relate to an acoustic lens positioned at an ultrasound probe. The acoustic lens may be configured for impedance matching and signal attenuation. In one embodiment, ultrasound signal attenuation is provided by forming an acoustic lens as a solid admixture of signal attenuating particles in a polymer matrix.

Abstract: The disclosed embodiments relate to a portable ultrasound device. Specifically, the disclosed embodiments relate to an acoustic lens positioned at an ultrasound probe. The acoustic lens may be configured for impedance matching and signal attenuation. In one embodiment, ultrasound signal attenuation is provided by forming an acoustic lens as a solid admixture of signal attenuating particles in a polymer matrix.

Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.

Abstract: Aspects of the technology described herein relate to an apparatus including an ultrasound-on-a-chip device configured to be bound to a user's wrist. The ultrasound-on-a-chip device may include a two-dimensional array of ultrasonic transducers. The transducers may be capacitive micromachined ultrasonic transducers (CMUTs) and may be configured to emit ultrasound waves having a frequency between approximately 5-20 MHz. A coupling strip may be coupled to the ultrasound-on-a-chip device to reduce the air gap between the ultrasound-on-a-chip device and the user's wrist. The ultrasound-on-a-chip device may be waterproof and may be able to perform both transverse and longitudinal ultrasound scanning without being rotated. The ultrasound-on-a-chip device may be configured to calculate pulse wave velocity through a blood vessel in a user's wrist.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities. Multiple ultrasound devices may be disposed on a substrate, which may be configured to be flexed so that the direction of emission of the ultrasound devices can be mechanically controlled. Additionally, or alternatively, the ultrasound beams produced by different ultrasound devices may be electronically oriented by adjusting the phases of the signals with which each element of a device is driven. For example, multiple phased arrays of ultrasound devices may be used to concentrate ultrasound energy into a desired location. In some embodiments, the time at which different ultrasound signals are emitted may be controlled, for example to ensure that the combined signal has at least a desired intensity.

Abstract: A system comprising a multi-modal ultrasound probe configured to operate in a plurality of operating modes associated with a respective plurality of configuration profiles; and a computing device coupled to the handheld multi-modal ultrasound probe and configured to, in response to receiving input indicating an operating mode selected by a user, cause the multi-modal ultrasound probe to operate in the selected operating mode.

Abstract: Ultrasound devices configured to perform high-intensity focused ultrasound (HIFU) are described. An ultrasound device may include HIFU units configured to emit high acoustic intensities and elasticity detectors configured to determine characteristics of the target area of a human body based on the elasticity of the target area. The elasticity detectors may determine, e.g., whether the target area is healthy, and if not, the type cell in need of treatment (e.g., the type of cancer cell present in the target area). In one example, the elasticity detectors may be configured to determine the stiffness of the target area, which may provide an indication as to the type of cell present in the area, by estimating the velocity of a shear wave propagating away from the target area. The shear wave may arise in response to the application of an ultrasound wave to the target area.

Abstract: Electrical biasing of ultrasonic transducers of an ultrasound device is described. The ultrasonic transducers may be capacitive micromachined ultrasonic transducers (CMUTs). The ultrasonic transducers may be grouped together, with the different groups receiving different bias voltages. The bias voltages for the various groups of ultrasonic transducers may be selected to account for differences between the groups.