Abstract: An absorbent pad for absorption and containment of oil based products. The absorbent pad includes a plurality of absorbent modules contained within a hydrophobic, porous and flexible top and base material, each absorbent module having a hydrophobic, oil absorbent material sealed therein, each of the plurality of absorbent modules being spaced from adjacent absorbent modules by a gap to allow the absorbent modules to flex and twist with respect to each other as well as permitting oil-based products to flow up through the gap between adjacent absorbent modules.

Abstract: An absorbent pad for absorption and containment of oil based products. The absorbent pad includes a plurality of absorbent modules contained within a hydrophobic, porous and flexible top and base material, each absorbent module having a hydrophobic, oil absorbent material sealed therein, each of the plurality of absorbent modules being spaced from adjacent absorbent modules by a gap to allow the absorbent modules to flex and twist with respect to each other as well as permitting oil-based products to flow up through the gap between adjacent absorbent modules.

Abstract: An apparatus and method for securing a substantially circular wafer uses a chuck having a plurality of tensioning grooves each having at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck center and the vacuum source applied to the grooves, the wafer is held securely to the surface without distortion.

Abstract: An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface. Additionally, there is disclosed an apparatus for securing a wafer comprising a chuck and a collar comprising a rigid support and an o-ring, the o-ring having a diameter slightly smaller than the outer perimeter. When the wafer is lowered onto the surface in a position concentric with the check centre, the collar is placed against the upper surface concentric with the perimeter and the vacuum source is applied securing the wafer to the surface.