Abstract: A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Abstract: A method of producing a microelectronic device resistant to tampering, inspection and damage from surrounding environment or operating conditions includes: (i) applying an adhesion layer on a circuit including a die fixed and electrically connected to a laminate substrate; (ii) spraying, through a flame spray process, a tamper resistant coating over the applied adhesion layer; (iii) applying a first encapsulant for filling spaces and air pockets; (iv) removing air and gases from the first encapsulant; and (v) applying a second encapsulant around the first encapsulant for providing a moisture barrier 42 and handling surfaces for the microelectronic device.

Abstract: A process for attaching a circuit element such as a capacitor to a substrate includes applying a conductive bonding material to electrical connections of the circuit element and/or substrate; placing the circuit element in position over the substrate; seating the circuit element in the conductive bonding material on the substrate; heating the bonding material to form a conductive bond; and applying a low viscosity wicking material around the area of the circuit element near the substrate. In some embodiments the conductive bonding material is a conductive epoxy such as silver or gold epoxy and the low viscosity wicking material is a flip chip underfill encapsulant.