Patents by Inventor James A. Tornello

James A. Tornello has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MEMS encapsulated structure and method of making same
    Patent number: 6800503
    Abstract: A method of fabricating an encapsulated micro electro-mechanical system (MEMS) and making of same that includes forming a dielectric layer, patterning an upper surface of the dielectric layer to form a trench, forming a release material within the trench, patterning an upper surface of the release material to form another trench, forming a first encapsulating layer that includes sidewalls within the another trench, forming a core layer within the first encapsulating layer, and forming a second encapsulating layer above the core layer, where the second encapsulating layer is connected to the sidewalls of the first encapsulating layer. Alternatively, the method includes forming a multilayer MEMS structure by photomasking processes to form a first metal layer, a second layer including a dielectric layer and a second metal layer, and a third metal layer. The core layer and the encapsulating layers are made of materials with complementary electrical, mechanical and/or magnetic properties.
    Type: Grant
    Filed: November 20, 2002
    Date of Patent: October 5, 2004
    Assignee: International Business Machines Corporation
    Inventors: Joseph T. Kocis, James Tornello, Kevin S. Petrarca, Richard Volant, Seshadri Subbanna
  • MEMS encapsulated structure and method of making same
    Publication number: 20040097003
    Abstract: A method of fabricating an encapsulated micro electro-mechanical system (MEMS) and making of same that includes forming a dielectric layer, patterning an upper surface of the dielectric layer to form a trench, forming a release material within the trench, patterning an upper surface of the release material to form another trench, forming a first encapsulating layer that includes sidewalls within the another trench, forming a core layer within the first encapsulating layer, and forming a second encapsulating layer above the core layer, where the second encapsulating layer is connected to the sidewalls of the first encapsulating layer.
    Type: Application
    Filed: November 20, 2002
    Publication date: May 20, 2004
    Applicant: International Business Machines Corporation
    Inventors: Joseph T. Kocis, James Tornello, Kevin S. Petrarca, Richard Volant, Seshadri Subbanna
  • Slurry for mechanical polishing (CMP) of metals and use thereof
    Publication number: 20030073593
    Abstract: Slurry compositions comprising an oxidizing agent, optionally a copper corrosion inhibitor, abrasive particles; surface active agent, a service of chloride and a source of sulfate ions.
    Type: Application
    Filed: August 30, 2002
    Publication date: April 17, 2003
    Inventors: Michael Todd Brigham, Donald Francis Canaperi, Michael A. Cobb, William Cote, Kenneth M. Davis, Scott Alan Estes, Edward Jack Gordon, James Willard Hannah, Mahadevaiyer Krishnan, Michael F. Lofaro, Michael Joseph MacDonald, Dean Allen Schaffer, George James Slusser, James A. Tornello, Eric Jeffrey White
  • Process to increase reliability CuBEOL structures
    Patent number: 6503834
    Abstract: The invention provides a process to increase the reliability of BEOL interconnects. The process comprises forming an array of conductors on a dielectric layer on a wafer substrate, polishing the upper surface so that the surfaces of the conductors are substantially co-planar with the upper surface of the dielectric layer, forming an alloy film on the upper surfaces of the conductors, and brush cleaning the upper surfaces of the conductors and the dielectric layer.
    Type: Grant
    Filed: October 3, 2000
    Date of Patent: January 7, 2003
    Assignee: International Business Machines Corp.
    Inventors: Xiaomeng Chen, Mahadevaiyer Krishnan, Judith M. Rubino, Carlos J. Sambucetti, Soon-Cheon Seo, James A. Tornello
  • Method for planarizing photoresist
    Patent number: 6361402
    Abstract: A method for polishing an object having a layer of photoresist, the method, employing the following steps: a) applying a layer of slurry on an a layer of photoresist on an object having a first and a second side, the layer of photoresist on one of the first and second side, the object having a center axis perpendicular to the first and second side; b) contacting the layer of slurry with a pad having a first and second side, the first side of the pad exerting a force on the slurry.
    Type: Grant
    Filed: October 26, 1999
    Date of Patent: March 26, 2002
    Assignee: International Business Machines Corporation
    Inventors: Donald F. Canaperi, Rangarajan Jagannathan, Mahadevaiyer Krishnan, Max G. Levy, Uma Satyendra, Matthew Sendelbach, James A. Tornello, William Wille