Abstract: Designs of improved canisters for animal semen straw storage in Dewars with cryogenic liquid are described. In some embodiments, the canisters include a layer of cryogen-absorbent material and an inner layer of thermally conductive material including apertures oriented and positioned to direct cryogen vapor into the interior of the container.

Abstract: Designs of improved canisters for animal semen straw storage in Dewars with cryogenic liquid are described. In some embodiments, the canisters include a layer of cryogen-absorbent material and an inner layer of thermally conductive material including apertures oriented and positioned to direct cryogen vapor into the interior of the container.

Abstract: Embodiments disclosed herein include thermal expansion actuators, systems using the same (e.g., microscopes), and methods of using the same. The thermal expansion actuators disclosed herein can include at least one beam coupled to and extending between a plurality of support portions. The thermal expansion actuators also include at least one heating element configured to heat at least a portion of the thermal expansion actuators, such as the at least one beam. The support portions are coupled to an structure (e.g., a component of a microscope) in a manner that at least partially restrains thermal expansion or contraction of the thermal expansion actuators in at least one direction when the thermal expansion actuators are heated or cooled, respectively. Restraining the thermal expansion actuators can controllably and selectively produce relative movement in the at least one beam (e.g., deflected).

Abstract: Designs of improved canisters for animal semen storage in Dewars are described.

Abstract: An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200.ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100.degree. C.-300.degree. C. for 0.5 hours-3.0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.