Patents by Inventor James ANNETT

James ANNETT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for structuring, patterning, and actuating devices using two-dimensional materials
    Patent number: 11318637
    Abstract: A method for patterning layers of 2D material by inducing self-assembly on a support substrate, the method comprising the steps of depositing a layer of 2D material on the support substrate; applying a force at a region consisting of a point, a line, or an a real region of the 2D material such that the 2D material forms a folded, self-contacting structure at that region.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: May 3, 2022
    Assignee: THE PROVOST, FELLOWS, SCHOLARS AND OTHER MEMBERS OF BOARD OF TRINITY COLLEGE DUBLIN
    Inventors: Graham Cross, James Annett
  • SYSTEMS AND METHODS FOR BOND PRICING
    Publication number: 20180189874
    Abstract: The present invention may be mainly embodied in a Bond Pricing System (BPS), which is a web-based tool for creating and pricing new bond issues. According to one particular embodiment, the BPS may be a web-based system that is coded in Java and Oracle. In general, the BPS accepts user input of bond pricing parameters (terms), retrieves historical pricing and market comparables data for similar bonds, prices the proposed bond, and generates a properly formatted bond pricing sheet. The bond pricing sheet is sent electronically to the Syndicate desk so that, upon approval, it can be sent to the bond issuer. A number of additional features of the BPS are disclosed.
    Type: Application
    Filed: November 19, 2013
    Publication date: July 5, 2018
    Inventors: Mark James Annett, Rajesh Dinesh Kalyanpur, Ramana Krishna Kiran Duddagi
  • Systems and Methods for Bond Pricing
    Publication number: 20180189873
    Abstract: The present invention may be mainly embodied in a Bond Pricing System (BPS), which is a web-based tool for creating and pricing new bond issues. According to one particular embodiment, the BPS may be a web-based system that is coded in Java and Oracle. In general, the BPS accepts user input of bond pricing parameters (terms), retrieves historical pricing and market comparables data for similar bonds, prices the proposed bond, and generates a properly formatted bond pricing sheet. The bond pricing sheet is sent electronically to the Syndicate desk so that, upon approval, it can be sent to the bond issuer. A number of additional features of the BPS are disclosed.
    Type: Application
    Filed: November 19, 2013
    Publication date: July 5, 2018
    Applicant: JPMorgan Chase Bank, N.A.
    Inventors: Mark James Annett, Rajesh Dinesh Kalyanpur, Ramana Krishna Kiran Duddagi
  • Method for structuring, patterning, and actuating devices using two-dimensional materials
    Publication number: 20170320234
    Abstract: A method for patterning layers of 2D material by inducing self-assembly on a support substrate, the method comprising the steps of depositing a layer of 2D material on the support substrate; applying a force at a region consisting of a point, a line, or an a real region of the 2D material such that the 2D material forms a folded, self-contacting structure at that region.
    Type: Application
    Filed: May 5, 2017
    Publication date: November 9, 2017
    Applicant: The Provost, Fellows, Foundation Scholars, & the other members of Board, of the College of the Holy
    Inventors: Graham CROSS, James ANNETT