Patents by Inventor James Bovatsek
James Bovatsek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10179374Abstract: The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.Type: GrantFiled: February 4, 2014Date of Patent: January 15, 2019Assignee: Newport CorporationInventors: James Bovatsek, Rajesh Patel
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Patent number: 9751154Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: GrantFiled: August 26, 2013Date of Patent: September 5, 2017Assignee: IMRA AMERICA, INC.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20170190000Abstract: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.Type: ApplicationFiled: March 22, 2017Publication date: July 6, 2017Applicant: IMRA AMERICA, INC.Inventors: James BOVATSEK, Alan Y. ARAI, Fumiyo YOSHINO
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Patent number: 9636773Abstract: A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques.Type: GrantFiled: February 13, 2013Date of Patent: May 2, 2017Assignee: IMRA AMERICA, INC.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20160067822Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.Type: ApplicationFiled: August 13, 2015Publication date: March 10, 2016Applicant: IMRA AMERICA, INC.Inventors: Alan Y. ARAI, Gyu C. CHO, Jingzhou XU, Fumiyo YOSHINO, Haibin ZHANG, James BOVATSEK, Makoto YOSHIDA
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Publication number: 20150367442Abstract: The present application is directed to a method and apparatus for processing a transparent or semitransparent material with a laser beam resulting in deterministic separation of a single sheet of the material into two or more pieces.Type: ApplicationFiled: February 4, 2014Publication date: December 24, 2015Applicant: NEWPORT CORPORATIONInventors: James Bovatsek, Rajesh Patel
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Patent number: 9138913Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are presented, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create multiple scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces different types of sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination through either light scattering or light reflection and nearly invisible without illumination. Transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.Type: GrantFiled: March 4, 2009Date of Patent: September 22, 2015Assignee: IMRA AMERICA, INC.Inventors: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida
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Publication number: 20140004318Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: ApplicationFiled: August 26, 2013Publication date: January 2, 2014Applicant: IMRA AMERICA, INC.Inventors: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
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Patent number: 8530786Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: GrantFiled: October 1, 2009Date of Patent: September 10, 2013Assignee: IMRA America, Inc.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Patent number: 8389891Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: GrantFiled: October 16, 2009Date of Patent: March 5, 2013Assignee: IMRA America, Inc.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Patent number: 8314359Abstract: Methods and systems for ultrashort pulse laser processing of optically transparent materials are disclosed. At least one embodiment includes a method for welding materials with ultrashort laser pulses to create a bond through localized heating, at least one material being transparent at a laser wavelength. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating sufficiently high fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines. In various implementations the laser is focused near the sub-surface interface between two materials, generating high fluence at the region proximate to the laser focus with minimal modification to the surrounding region, including areas above and below the laser beam waist.Type: GrantFiled: October 16, 2009Date of Patent: November 20, 2012Assignee: IMRA America, Inc.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20100086741Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: ApplicationFiled: October 16, 2009Publication date: April 8, 2010Applicant: IMRA America, Inc.Inventors: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20100084384Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: ApplicationFiled: October 16, 2009Publication date: April 8, 2010Applicant: IMRA America, Inc.Inventors: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20100025387Abstract: Methods, devices, and systems for ultrashort pulse laser processing of optically transparent materials are disclosed, with example applications in scribing, marking, welding, and joining. For example, ultrashort laser pulses create scribe features with one pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with correctly aligned illumination. Reflective marks may also be formed with control of laser parameters. A transparent material other than glass may be utilized. A method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating.Type: ApplicationFiled: March 4, 2009Publication date: February 4, 2010Applicant: IMRA AMERICA, INC.Inventors: Alan Y. Arai, Gyu C. Cho, Jingzhou Xu, Fumiyo Yoshino, Haibin Zhang, James Bovatsek, Makoto Yoshida
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Publication number: 20100012631Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: ApplicationFiled: October 1, 2009Publication date: January 21, 2010Inventors: James BOVATSEK, Alan Y. Arai, Fumiyo Yoshino
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Patent number: 7626138Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: GrantFiled: September 8, 2006Date of Patent: December 1, 2009Assignee: Imra America, Inc.Inventors: James Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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Publication number: 20070051706Abstract: Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials.Type: ApplicationFiled: September 8, 2006Publication date: March 8, 2007Inventors: James Bovatsek, Alan Arai, Fumiyo Yoshino
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Publication number: 20060207976Abstract: Various embodiments of a system described herein relate to micromachining materials using ultrashort visible laser pulses. The ultrashort laser pulses may be green and have a wavelength between about 500 to 550 nanometers in some embodiments. Additionally, the pulses may have a pulse duration of less than one picosecond in certain embodiments.Type: ApplicationFiled: January 20, 2006Publication date: September 21, 2006Inventors: James Bovatsek, Alan Arai, Lawrence Shah, Fumiyo Yoshino
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Publication number: 20050226287Abstract: A femtosecond laser based laser processing system having a femtosecond laser, frequency conversion optics, beam manipulation optics, target motion control, processing chamber, diagnostic systems and system control modules. The femtosecond laser based laser processing system allows for the utilization of the unique heat control in micromachining, and the system has greater output beam stability, continuously variable repetition rate and unique temporal beam shaping capabilities.Type: ApplicationFiled: March 31, 2004Publication date: October 13, 2005Inventors: Lawrence Shah, James Bovatsek, Alan Arai, Tadashi Yamamoto, Rajesh Patel, Donald Harter