Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

Abstract: A cleaning system for cleaning boxes or containers used to carry semiconductor wafers has box holder assemblies attached to a rotor within an enclosure. Liquid spray manifolds have one or more spray nozzles that spray at an angle toward or away from the direction of rotation of the rotor, or an angle up or down, rather than straight at the boxes in the box holder assemblies. Improved spray coverage and cleaning is achieved.

Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution. The chelating agent solution removes metallic contamination from the containers. The containers are then rinsed with a rinsing liquid, such as deionized water and a surfactant. The containers are then dried, preferably by applying heat and/or hot air movement.

Abstract: In a method for cleaning for cleaning metallic ion contamination, and especially copper, from wafer containers, the containers are loaded into a loader of a cleaning apparatus. The containers are sprayed with a dilute chelating agent solution, while the rotor is spinning. The chelating agent solution removes metallic contamination from the containers. The containers are then sprayed with a rinsing liquid, such as deionized water and a surfactant while the rotor is spinning and heat is applied. The containers are then dried by applying heat, hot air movement and spinning the rotor.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.

Abstract: A machine for cleaning containers has inside and outside arrays of nozzles arranged to spray a cleaning solution onto containers supported on a spinning rotor. Used cleaning solution is diverted to a reclaim tank for reuse, thereby allowing low-cost cleaning with concentrated chemicals, and with the creation of less liquid waste requiring disposal. In a method for removing contaminants from flat media or silicon wafer containers or carriers, a mixture of surfactant and de-ionized water is sprayed onto containers on a spinning rotor. The used cleaning solution is collected, filtered and reused.