Abstract: An optical packaging assembly (10) for securing an optical fiber (12) to a heater substrate (30) in optical alignment with an opto-electronic device (14). The opto-electronic device (14) is secured to a device substrate (18) in the packaging assembly (10). The heater substrate (30) includes a conductive region (44), resistive elements (52) and a solder platform (42). The optical fiber (12) and a solder preform (32) are positioned on the solder platform (42). A voltage potential is applied to the conductive region (44) to heat the resistive elements (52) to cause the solder preform (32) to melt and secure the optical fiber (12) to the heater substrate (30) in alignment with the opto-electronic device (14). The resistive elements (52) are symmetrically disposed around the solder platform (42) to minimize translational and rotational shifts of the optical fiber (12) to primarily one translational axis of motion when the solder preform (32) cools.

Abstract: Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multi-layer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

Abstract: Fault tolerance is incorporated within the integral electric heaters of a reworkable electronic semiconductor component, such as a reworkable multi-chip module, to increase production yield and longevity of the rework feature. Components of the foregoing kind contain a multilayer substrate to bond to a printed wiring board, and, for rework, the component includes a plurality of electric heaters arranged side by side on a bottom layer of the substrate. When energized with current, the heaters generate sufficient heat to weaken the adhesive or solder bond to the printed wiring board without delaminating the layers of the substrate, allowing the electronic semiconductor component to be pulled away from the printed wiring board for rework. Additional circuitry is included to automatically route heater current around, that is bypass, any current-interrupting break(s) as may form in any of the electric heaters giving the heaters a fault tolerance.

Abstract: The invention relates to a method for producing low cost integrated microwave assemblies, where a photoresist layer is deposited onto a substrate, a portion of the photoresist is selectively removed, a first conductive layer is applied, and, a second portion of the photoresist is removed leaving isolation walls and cavities. Electrical components are placed in the cavities and a first dielectric layer fills the cavities. Vias are created in the first dielectric material exposing the electrical contacts, a second conductive layer is applied into the vias and over the first dielectric material. The second conductive layer is patterned by removing a portion of the second conductive layer creating a signal line pattern in the second conductive layer.

Abstract: The present invention provides a new and effective method for the sealing and electrical testing of electronic devices; and particularly for surface acoustic wave devices. In accordance with the present invention, the cost and size of making hermetically sealed packages for electronic devices and of electrically testing each device is significantly reduced over the prior art by making use of mass simultaneous sealing and electrical connection at the wafer level, and by using substrates with hermetically sealed and electrically conductive via holes. Further, cost reduction is effected by making use of final electrical testing with wafer probe test techniques before dicing.

Abstract: A resealable gas concentration sensor for determining the concentration of a particular gas within a gaseous environment. The sensor is constructed of a housing and a cap. The cap is adapted to be temporarily coupled with the housing while in the environment to define a sealed sample chamber, thereby capturing a sample of the environment. A venturi tube having a narrow passage is affixed to the housing which is adapted to allow fluid flow through venturi tube into test equipment for determining the concentration of the gas in the sample. The housing and cap may be repeatedly uncoupled and resealed to capture additional samples and measure other concentrations.

Abstract: An electrical testing device is provided for testing integrated circuits located on a wafer. The testing device employs a multi-layer test circuit having a plurality of contacts for contacting the integrated circuits on a wafer. The layers of the test circuit are embedded in a flexible, supportive dielectric material which allows vertical flexing of the contacts. Cross bar switches are further employed to switch among the plurality of contacts thereby enabling the testing of individual dies of the water to be tested. A microprocessor is further included for controlling the switching and the testing of each die. In an alternate embodiment, the plurality of contacts are mechanically moved relative to the wafer to allow testing of the dies without the need for the switches.

Abstract: An integrated waveguide/stripline signal transition structure and method for fabricating the same are provided for allowing high frequency signal transitions. The signal transition structure includes a waveguide which has a conductive cavity for guiding electromagnetic waves therethrough. A first conductive circuit layer is fabricated within the conductive cavity and is electrically connected thereto. A second conductive signal layer is fabricated within the conductive cavity and is isolated from the conductive cavity and the first conductive signal layer. A plurality of dielectric layers are provided which suspend the first and second conductive signal layers within the conductive cavity. The second conductive signal layer and the conductive cavity thereby allow for signal transitions therebetween. The first and second conductive signal layers and dielectric material are integrally fabricated on top of a removable material which is subsequently removed.

Abstract: This invention discloses a method of fabricating a plurality of diamond semiconductor wafers from a single crystal diamond semiconductor boule, where the diamond boule is grown by a chemical vapor deposition (CVD) process. Initially, a single crystal diamond seed is polished and an impurity layer is deposited on the polished seed crystal. The CVD growth process is then initiated to deposit a layer of single crystal diamond over the impurity layer to form the diamond boule. At desirable intervals, the CVD growth process is stopped and a surface of the diamond boule is polished in order to accept another impurity layer. Each impurity layer is photolithographically patterned in order to generate an alternating configuration of impurity regions and hole regions. The impurity regions and the hole regions enable the bond between the diamond layers to be weakened without causing the crystalline orientation to deviate.

Abstract: A method for trimming thin film resistors. A focused inert ion beam is employed to selectively remove portions of a resistive film deposited on a substrate.

Abstract: An electric motor has a can-like casing and an end cap. Brushgear is mounted on a frame prior to insertion into the motor. The frame holds the brushes of the brush gear away from a commutator of the motor by means of resilient arms which engage the brush gear. As the frame is inserted into the motor the arms come against a post which bends the arms to disengage them from the brush arms so that the brushes settle onto the commutator.