Patents by Inventor James C Shipley
James C Shipley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9448278Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.Type: GrantFiled: June 22, 2015Date of Patent: September 20, 2016Assignee: INTEL CORPORATIONInventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish Gupta
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Patent number: 9347987Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.Type: GrantFiled: November 6, 2009Date of Patent: May 24, 2016Assignee: INTEL CORPORATIONInventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
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Patent number: 9207274Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.Type: GrantFiled: November 6, 2009Date of Patent: December 8, 2015Assignee: INTEL CORPORATIONInventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
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Publication number: 20150285857Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.Type: ApplicationFiled: June 22, 2015Publication date: October 8, 2015Inventors: Christopher R. SCHROEDER, Christopher W. ACKERMAN, James C. SHIPLEY, Tolga ACIKALIN, Ioan SAUCIUC, Michael L. RUTIGLIANO, James G. MAVEETY, Ashish GUPTA
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Publication number: 20110109335Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.Type: ApplicationFiled: November 6, 2009Publication date: May 12, 2011Inventors: Christopher R. Schroeder, Christopher W. Ackerman, James C. Shipley, Tolga Acikalin, Ioan Sauciuc, Michael L. Rutigliano, James G. Maveety, Ashish X. Gupta
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Patent number: 7864541Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: GrantFiled: January 12, 2010Date of Patent: January 4, 2011Assignee: Radisys CorporationInventors: Christopher D. Lucero, Javier Leija, James C. Shipley, Christopher A. Gonzales
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Publication number: 20100118490Abstract: A method according to one embodiment may include providing a baffle assembly comprising at least one airflow control zone with an airflow resistance. The method of this embodiment may also include positioning said baffle assembly in a flow of air through a chassis. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: ApplicationFiled: January 12, 2010Publication date: May 13, 2010Applicant: RADISYS CORPORATIONInventors: Christopher D. Lucero, Javier Leija, James C. Shipley, Christopher A. Gonzales
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Patent number: 7701238Abstract: In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.Type: GrantFiled: June 26, 2007Date of Patent: April 20, 2010Assignee: Intel CorporationInventors: Anthony Yeh Chiing Wong, Victor Henckel, Boon Liang Heng, Christopher Wade Ackerman, James C. Shipley
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Publication number: 20090002010Abstract: In one embodiment, the present invention includes a burn-socket for insertion into a test board, where the burn-in socket is coupled to receive a semiconductor device under test (DUT). The burn-in socket includes a substrate to support the semiconductor DUT, which includes a heating element embedded in a layer of the substrate. Other embodiments are described and claimed.Type: ApplicationFiled: June 26, 2007Publication date: January 1, 2009Inventors: Anthony Yeh Chiing Wong, Victor Henckel, Boon Liang Heng, Christopher Wade Ackerman, James C. Shipley
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Publication number: 20080302783Abstract: In one embodiment, a test board includes a plurality of socket locations each to receive a corresponding burn-in socket which in turn is to receive a semiconductor device under test (DUT). Each of the socket locations includes a heating element embedded within the test board, which may be used to provide thermal conduction to the DUT during a burn-in test. Other embodiments are described and claimed.Type: ApplicationFiled: June 8, 2007Publication date: December 11, 2008Inventors: Anthony Yeh Chiing Wong, Christopher Wade Ackerman, James C. Shipley, Hon Lee Kon
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Patent number: 7316606Abstract: A method according to one embodiment may include providing a chassis comprising at least one selectively deployable fan disposed within the chassis. The method of this embodiment may also include moving the fan from a stowed configuration to a deployed configuration within the chassis and energizing the at least one fan. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.Type: GrantFiled: February 8, 2005Date of Patent: January 8, 2008Assignee: Intel CorporationInventors: James C Shipley, Javier Leija, Christopher A Gonzales, Christopher D Lucero
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Patent number: 7215552Abstract: In general, in one aspect, the disclosure describes an apparatus to redistribute airflow throw slots of a chassis that houses boards. The apparatus includes at least one restriction region to limit airflow therethrough. The apparatus further includes an open region to allow airflow to pass therethrough. At least some of the airflow limited by the at least one restriction region will flow through the open region. The apparatus also includes a connection mechanism to connect to a chassis.Type: GrantFiled: March 23, 2005Date of Patent: May 8, 2007Assignee: Intel CorporationInventors: James C Shipley, Javier Leija, Christopher A Gonzales, Christopher D Lucero
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Patent number: 7209364Abstract: A method according to one embodiment may include providing a circuit board assembly comprising a circuit board and a rotatable knob and at least one latch coupled to the knob via a linkage. The method of this embodiment may also include moving the at least one latch to a retracted position by rotating the knob, and inserting the circuit board assembly into a chassis. The method may then include moving the latch to an extended position. Of course, many alternatives, variations, and modification are possible without departing from this embodiment.Type: GrantFiled: December 29, 2004Date of Patent: April 24, 2007Assignee: Intel CorporationInventors: James C. Shipley, Javier Leija, Christopher A. Gonzales, Christopher D. Lucero
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Patent number: 7083449Abstract: In general, in one aspect, the disclosure describes an apparatus that includes a latch to connect a board to a chassis. The apparatus further includes a pull lever to control whether said latch is retracted or extended. The latch connects the board to the chassis when it is extended.Type: GrantFiled: March 29, 2005Date of Patent: August 1, 2006Assignee: Intel CorporationInventors: Javier Leija, James C Shipley, Christopher A Gonzales, Christopher D Lucero
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Publication number: 20040060691Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.Type: ApplicationFiled: September 26, 2003Publication date: April 1, 2004Applicant: Intel CorporationInventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons
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Patent number: 6651736Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.Type: GrantFiled: June 28, 2001Date of Patent: November 25, 2003Assignee: Intel CorporationInventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons
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Publication number: 20030000690Abstract: A thermal conducting material with higher thermal conductivity for a given low viscosity is shown. Carbon fibers are added to the thermal grease to promote thermal conductivity. The carbon fibers are also not highly electrically conductive, reducing the danger of short circuiting due to misapplication of the thermal grease. Due to the high thermal conductivity of the carbon fibers, a lower loading percentage is needed to obtain significant gains in thermal conductivity. The low loading percentages in turn permit lower thermal grease viscosity, which allows the thermal grease to be spread very thin during application.Type: ApplicationFiled: June 28, 2001Publication date: January 2, 2003Applicant: Intel CorporationInventors: Chia-Pin Chiu, James C. Shipley, Craig B. Simmons