Abstract: This invention is directed to novel photoresist processes and compositions having high resolution novalac resins, high resolution photoactive components with several diazoquinone groups per molecule, and solvents having a high solvency power, better safety, improved photospeed, higher contrast and equivalent cast film thickness from lower percent solids formulations.

Abstract: The present invention provides compositions which comprise a blend of: p0 (a) from about 10 to about 97 percent by weight of the composition of a polyamide resin having a minimum molecular weight of about 5,000; p0 (b) from about 3 to about 90 percent by weight of the composition of an elastomeric polymer which(1) is selected from a group consisting of poly(ethylene oxide), poly(propylene oxide), polycaprolactone, polytetrahydrofuran, polybutadiene, polyisoprene, polyisobutylene, poly(C.sub.1 -C.sub.8 alkylene acrylate), poly(C.sub.1 -C.sub.4 dialkylene siloxane), poly(ethylene-co-propylene), poly(ethylene-co-carbon monoxide), polyethylene-co-vinyl chloride, and poly(ethylene-co-vinyl acetate) polymers and copolymers and combinations thereof; and(2) contains a minimum of about 0.055 milliequivalents of acyllactam groups per gram of said elastomeric polymer.

Abstract: Polyamide compositions comprising:(a) poly(.epsilon.-caprolactam) resin of viscosity average molecular weight of at least about 15,000; and(b) at least one block polymer having(i) from about 25 to about 80 weight percent poly(.epsilon.-caprolactam) segments of the formula ##STR1## wherein x is an integer equal to 5 or more; and (ii) from about 75 to about 20 weight percent of segments having a number average molecular weight of at least 300 selected from the group consisting of segments of poly(propylene oxide), polycaprolactone, polytetrahydrofuran, polybutadiene, polyisoprene, polyisobutylene, poly(C.sub.1 -C.sub.8 alkylene acrylate), poly(C.sub.1 -C.sub.

Abstract: This invention relates to construction panels comprising metal-thermoplastic-metal laminates and a process for preparing same, said laminates possessing in combination critical service properties of low coefficient of linear thermal expansion, low inelastic ratio, and excellent flexural stiffness.

Abstract: This invention relates to construction panels comprising metal-thermoplastic-metal laminates and a process for preparing same, said laminates possessing in combination critical service properties of high heat distortion temperature, low coefficient of linear thermal expansion, low inelastic ratio, and lightness in weight.

Abstract: Polyamide compositions comprising:(a) at least one polyamide resin of number average molecular weight of at least 5000; and(b) at least one block polymer having(i) from about 30 to about 70 weight percent polyamide segments selected from ##STR1## wherein x is an integer equal to five or more and y is an integer equal to three or more;(ii) from about 70 to about 30 weight percent of segments having a molecular weight of at least 300 selected from the group consisting of segments of poly(ethylene oxide), poly(propylene oxide), polycaprolactone, polytetrahydrofuran, polybutadiene, polyisoprene, polyisobutylene, poly(C.sub.1 -C.sub.8 alkylene acrylate), poly(C.sub.1 -C.sub.4 dialkylene siloxane), poly(ethylene-co-propylene), poly(ethylene-co-carbon monoxide) and combinations thereof; said (ii) segments being connected to an (i) polyamide segment through groups selected from amide, ester, urea, carbamate and imide; and(iii) greater than 0.

Abstract: Lightweight metal-thermoplastic-metal laminates exhibiting an improved combination of good formability and bending strength comprise a core layer of a thermoplastic material selected from certain partly crystalline polyamides and polyesters, and a metal layer of certain aluminum alloys laminated on each side of the core layer, said thermoplastic and metal layers having certain requirements with respect to thickness and tensile elongation, and, additionally for the metal, tensile offset yield strength.

Abstract: Polyamide molding resin compositions are prepared by melt-blending a polyamide resin, a hydroxyl-functional elastomer and a succinic-functional coupling agent. The invention includes a process fore preparing the molding resin and the molded resin product.

Abstract: The present invention relates to amino-functional photopolymer compositions and to photo-oxidation imaging processes utilizing such compositions. The amino-functional photopolymer compositions comprise amino-functional polymers. For example, other polymers or resins without amino-functionality may be incorporated to aid in adapting the compositions for use in particular applications as are discussed herein.

Abstract: The present invention relates to amino-functional photopolymer compositions and to photo-oxidation imaging processes utilizing such compositions. The amino-functional photopolymer compositions comprise amino-functional polymers and photosensitizing agents which, when exposed to electromagnetic radiation in the presence of ordinary molecular oxygen, are cured, thereby forming a less soluble polymer. Where the irradiation has been done selectively or in an imagewise fashion, the compositions allow for the development of an image by virtue of the solubility or redispersibility differential between the exposed and unexposed portions of the compositions. The amino-functional photopolymer may be any of a large variety of types, but generally will comprise a polymer with two or more amino-functional groups. The polymer may be a soluble polymer or a small-particle-size microgel cross-linked polymer. The photopolymer may also comprise mixtures of soluble polymer and small-particle-size microgel cross-linked polymer.