Abstract: An example proof mass assembly includes a proof mass; a proof mass support; a flexure connecting the proof mass to the proof mass support, wherein the proof mass is configured to rotate relative to the proof mass support via the flexure; a first resonator connected to a first major surface of the proof mass and a first major surface of the proof mass support; and a second resonator connected to a second major surface of the proof mass and a second major surface of the proof mass support, wherein at least one of the proof mass, the proof mass support, the flexure, the first resonator, or the second resonator is formed by selective laser etching.

Abstract: A proof mass assembly includes a monolithic substrate, the monolithic substrate including a proof mass, a proof mass support, and a flexure connecting the proof mass to the proof mass support. The proof mass is configured to rotate relative to the proof mass support via the flexure. The monolithic substrate further includes a first resonator connected to a first major surface of the proof mass and a first major surface of the proof mass support and a second resonator connected to a second major surface of the proof mass and a second major surface of the proof mass support.

Abstract: Systems and methods for conductive pillars are provided. In one embodiment, a system comprises an electrical board comprising an electrical device, and a packaged die, the packaged die bonded to the electrical board. The packaged die comprises a substrate layer, the substrate layer comprising a recessed area, a conductive trace, wherein a portion of the conductive trace is formed in the recessed area, and an epitaxial device layer bonded to the substrate layer. The device layer comprises a MEMS device, and an epitaxial conductive pillar, wherein a first side of the epitaxial conductive pillar is electrically connected to the conductive trace and the second side of the epitaxial conductive pillar is electrically connected to the electrical board, wherein the epitaxial conductive pillar extends through the epitaxial device layer to electrically couple the conductive trace to an interface surface on the epitaxial device layer.

Abstract: Systems and methods for conductive pillars are provided. In one embodiment, a system comprises an electrical board comprising an electrical device, and a packaged die, the packaged die bonded to the electrical board. The packaged die comprises a substrate layer, the substrate layer comprising a recessed area, a conductive trace, wherein a portion of the conductive trace is formed in the recessed area, and an epitaxial device layer bonded to the substrate layer. The device layer comprises a MEMS device, and an epitaxial conductive pillar, wherein a first side of the epitaxial conductive pillar is electrically connected to the conductive trace and the second side of the epitaxial conductive pillar is electrically connected to the electrical board, wherein the epitaxial conductive pillar extends through the epitaxial device layer to electrically couple the conductive trace to an interface surface on the epitaxial device layer.

Abstract: Methods and apparatus for the fluid delivery and removal of micron scale structures that increase the efficiency of such fluid delivery and removal. An exemplary method for fluid delivery of a micron scale structure includes providing a silicon device that comprises a plurality of wells. Each of the wells includes a bottom wall, a side wall, a top opening and a plurality of protrusions that extend into the interior of the well. A plurality of micron scale structures are delivered into the wells using a fluid. The fluid is then removed from the wells, whereby spaces between the protrusions facilitate flow and removal of the fluid. The protrusions then retain the plurality of micron scale structures in the wells.