Abstract: Handheld ultrasound devices with display-retaining designs that allow the processor/display assembly to be removed and/or repositioned are provided. According to one embodiment, a handheld ultrasound scanning device includes a main body housing having a first side and a second side. An ultrasound transducer is coupled to the second side and is configured to obtain ultrasound data. A communication interface is communicatively coupled to the ultrasound transducer and configured to transmit the ultrasound data obtained by the ultrasound transducer to a processor and display assembly. The first side of the main body housing includes a retention feature that is configured to retain the processor and display assembly in contact with the main body housing at a position and orientation relative to the main body housing.

Abstract: The present application provides an ultrasound probe comprising a housing that includes a coupling interface having a sinusoidal geometry. The housing is formed by a first body (300) and a second body having opposite and corresponding sinusoidal geometries. The first body includes a first proximal portion (105) and a first distal portion (107). The first proximal portion comprises a first sinusoidal shape (326). The second body includes a second proximal portion and a second distal portion. The second proximal portion comprises an opposite second sinusoidal shape. The first body and the second body are coupled to form a handle having a sinusoidal interface. Further, the first distal portion and the second distal portion form a head portion at which the ultrasound transducer assembly is disposed.

Abstract: System, devices, and methods for coupling portions of a medical device handle are provided. A male portion (202) and a female portion (204) of the handle may be coupled together using a sealant (244) such as room temperature vulcanized silicone rubber (RTV) using in conjunction with ultrasonic welding. The RTV may be applied to one of the male or female portions and the portions may be joined using a tongue (215) and groove (2259 connection, displacing the RTV from the weld site. The RTV helps to seal the bondline (206) after ultrasonic welding.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the probe spaceframe or transducer stack backing block and may use a Peltier device. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the transducer backing block. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.

Abstract: A matrix array probe including a transducer array and integrated circuitry coupled to the transducer elements dissipates heat generated by the array and integrated circuitry through the cover of the transducer probe. A pump in the probe connector pumps fluid through a closed loop system including inbound an outbound fluid conduits in the cable. The fluid conduits in the cable are separated by the cable electrical conductors for the probe. The heat transfer in the probe is done by a heat exchanger in the probe spaceframe or transducer stack backing block and may use a Peltier device. Additional cooling may be provided by metal to metal contact with a chiller in the ultrasound system.