Patents by Inventor James Clink

James Clink has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered circuit board for high-speed, differential signals
    Patent number: 7057115
    Abstract: The present invention provides a circuit board having a differential signal pad pair consisting of a first signal pad and a second signal pad. The first signal pad has (i) a signal via extending therethrough for electrically connecting the first signal pad to a first transmission line of a differential signal path located within the circuit board and (ii) a contact section for receiving a first contact element of a connector. The second signal pad has (i) a signal via extending therethrough for electrically connecting the second signal pad to a second transmission line of the differential signal path and (ii) a contact section for receiving a second contact element of the connector. The distance between the signal via in the first signal pad and the signal via in the second signal pad is greater than the distance between the contact section of the first signal pad and contact section of the second signal pad.
    Type: Grant
    Filed: June 28, 2004
    Date of Patent: June 6, 2006
    Assignee: Litton Systems, Inc.
    Inventors: James Clink, John E. Benham, John Mitchell
  • Multilayered circuit board for high-speed, differential signals
    Publication number: 20050161254
    Abstract: The present invention provides a multilayered circuit board that can be used in high-density and high-speed electronic applications.
    Type: Application
    Filed: June 28, 2004
    Publication date: July 28, 2005
    Applicant: Litton Systems, Inc.
    Inventors: James Clink, John Benham, John Mitchell