Abstract: A method for semiconductor processing is provided, wherein a semiconductor wafer having undergone polishing is provided. The semiconductor wafer has an active region positioned between one or more moat regions, wherein the one or more moat regions have an oxide disposed therein. A top surface of the active region is recessed from a top surface of the moat region, therein defining a step having a step height associated therewith. A step height is measured, and a photoresist is formed over the semiconductor wafer. A modeled step height is further determined, wherein the modeled step height is based on the measured step height and a desired critical dimension of the photoresist. A dosage of energy is determined for patterning the photoresist, wherein the determination of the dosage of energy is based, at least in part, on the modeled step height. The photoresist is then patterned using the determined dosage of energy.

Abstract: A device and method for measuring ion beam angle with respect to a substrate is disclosed. The method includes forming a plurality of shadowing structures extending substantially perpendicular from an upper surface of the substrate, directing an ion beam toward the substrate, the plurality of shadowing structures interrupting an incident angle of the ion beam to define implanted and non-implanted portions of the substrate. The method further includes measuring the dose of implanted species within the substrate, determining an implanted surface area as a function of measuring the dose of implant, determining non-implanted surface area based on the implanted surface area, and obtaining the ion beam angle as a function of the non-implanted surface area.

Abstract: A method for semiconductor processing is provided, wherein a semiconductor wafer having undergone polishing is provided. The semiconductor wafer has an active region positioned between one or more moat regions, wherein the one or more moat regions have an oxide disposed therein. A top surface of the active region is recessed from a top surface of the moat region, therein defining a step having a step height associated therewith. A step height is measured, and a photoresist is formed over the semiconductor wafer. A modeled step height is further determined, wherein the modeled step height is based on the measured step height and a desired critical dimension of the photoresist. A dosage of energy is determined for patterning the photoresist, wherein the determination of the dosage of energy is based, at least in part, on the modeled step height. The photoresist is then patterned using the determined dosage of energy.

Abstract: A device and method for measuring ion beam angle with respect to a substrate is disclosed. The method includes forming a plurality of shadowing structures extending substantially perpendicular from an upper surface of the substrate, directing an ion beam toward the substrate, the plurality of shadowing structures interrupting an incident angle of the ion beam to define implanted and non-implanted portions of the substrate. The method further includes measuring the dose of implanted species within the substrate, determining an implanted surface area as a function of measuring the dose of implant, determining non-implanted surface area based on the implanted surface area, and obtaining the ion beam angle as a function of the non-implanted surface area.