Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.

Abstract: Embodiments of the present invention provide for non interruptive fluid cooling of an electronic enclosure. One or more electronic component packages may be removable from a circuit card having a fluid flow system. When installed, the electronic component packages are coincident to and in a thermal relationship with the fluid flow system. If a particular electronic component package becomes non-functional, it may be removed from the electronic enclosure without affecting either the fluid flow system or other neighboring electronic component packages.

Abstract: One embodiment provides an air baffle assembly for controlling airflow through a cable opening in a rack. The rack is configured for removably supporting a plurality of modular electronic components. The cable opening on the rack receives a plurality of cables connected to the modular electronic components. The air baffle assembly includes a track secured to the rack adjacent to the cable opening and an air baffle movably supported on the track over the cable opening. The track includes a rail guideway. The air baffle includes at least a flexible first rail movably received by the first rail guideway. The first rail flares laterally along a range of engagement of the first rail with the first rail guideway, to bias the air baffle in one longitudinal direction.

Abstract: One embodiment of the invention provides a rack assembly for cooling a computer system. A rack provides support for one or more columns of heat-generating electronic devices. Device fans move air from an air inlet side of the rack through the devices and through an air outlet side of the rack. A unitary door has a support frame spanning the air outlet side of the rack and hingedly coupling the door to a rear vertical edge of the rack. The unitary door includes an air-to-liquid heat exchanger panel spanning an air outlet passage inside the support frame so that substantially all of the air passing through the air outlet side of the rack must pass through the heat exchanger panel. The air outlet passage has a cross-sectional area that is substantially equal to or greater than the cross-sectional area of the one or more columns of heat-generating devices.

Abstract: Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.

Abstract: A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

Abstract: Apparatus for removing a printed circuit board (PCB) and bezel assembly from a unit includes a pull spring is attached to opposing sides of the PCB and bezel assembly. Each pull spring includes a generally M-shaped spring. A first end of the M-shaped spring includes a first pin carrying a knob. The first pin extends through an opening in the bezel and the knob is disposed within a recessed portion of the bezel and is generally flush with a front face of the bezel with the M-shaped spring compressed in a normal constrained position. In an extended position when the M-shaped springs return to a substantially uncompressed state, the knobs are pushed forward and are spaced apart in front of the bezel, enabling a person to grip and pull each knob to remove the PCB and bezel assembly from the unit in which it is installed.

Abstract: In a system for liquid cooling of electronics, where the electronics are subject to rotation in space, a liquid coolant storage tank includes a degassing and vortex-preventing structure to allow bubbles to float to the surface of the liquid inside the tank, and also to prevent vortices from forming near the outlet from the tank. The structure includes nested tubes or conduits. An inner conduit extends from the inlet into the tank, and its open end is covered by a second conduit with a baffle across its end, so that the flow is directed by the baffle to flow back along the outside of the inner conduit, and inside of the outer conduit. Especially at the inlet, a third conduit with large perforations surrounds the open end of the outer conduit. Smaller perforations on the inner conduit at the outlet side discourage any vortex from forming there. Reversal of the liquid flow, and the gradual increase in flow cross section prevent surging inside the tank.