Abstract: An x-ray system includes an x-ray tube having an anode and a cathode, a sensor configured to sense a condition that results from an operation of the x-ray tube, and a communication device for transmitting a signal to a panel based at least in part on the sensed condition, the panel configured to receive radiation and generate image signals in response to the received radiation. An imaging method includes sensing a condition that results from an operation of an x-ray tube, and transmitting a signal to a panel in response to the sensed condition, wherein the panel is configured to generate image signals in response to radiation, and includes a plurality of image elements.

Abstract: Man-portable radiation generation sources and systems that may be carried by hand to a site of interest by one or two people, are disclosed. Methods of use of such sources and systems are also disclosed. Battery operated radiation generation sources, air cooled radiation generation sources, and charged particle accelerators, are also disclosed. A radiation generation source with a target less than 0.20 mm is also disclosed.

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

Abstract: An electrical connector comprises an elongated flexible circuit having rigid strips bonded onto one or both sides and one or more ends thereof. The strips contain metallized castellations that are aligned with respective metal traces on the flex circuit and soldered thereto. The flexible portion, along with the attached rigid board(s) forms a plug assembly that mates with a socket having contact pins that engage with their respective metallized castellations, with the castellations providing a self-aligning function. The invention may be used to form a flex cable with connectors on one or both ends. Alternatively, the elongated flexible circuit may represent an extension of a larger flex circuit substrate that further contains other electronic devices mounted thereon. The socket and contact pins are preferably attachable to a motherboard by soldering or other means.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract: In one example, a radiation scanning system and method rotates a cargo conveyance after removal from a ship for proper orientation with respect to a scanning source and detector, for scanning. A movable carriage may be provided on a crane system, to rotate the cargo conveyance. A rotating flywheel on the carriage rotates in a direction opposite the direction of rotation of the cargo conveyance, to counterbalance angular momentum generated by the rotating conveyance, to avoid or minimize twisting of the carriage. Feedback is provided to control the rotation of the flywheel. Once the cargo conveyance is in the predetermined position, the conveyance is moved between the radiation source and detector for scanning by a vertically extending radiation beam.

Abstract: A method of manufacturing a radiation source in one example comprises selecting at least one of a target, a collimator, or target shielding consisting essentially of at least one isotope having a neutron production threshold greater than a peak acceleration energy of the source, and assembling the source including the selected material. A simulation may be used to assist in design a radiation source meeting neutron production requirements and optionally other requirements.

Abstract: Compact, dual energy radiation scanning systems are described comprising two particle beam accelerators, each configured to accelerate charged particles to different energies, positioned parallel to a direction of movement of an object to be inspected. The accelerator may be positioned perpendicular to a plane of the conveying system, instead. Bend magnet systems bend each charged particle beam toward a respective target. Alternatively, a single dual energy accelerator capable of accelerating charged particles to at least two different energies is positioned parallel to the direction of movement of the object, or perpendicular to a plane of the conveying system. A single bend magnet system is provided to bend each accelerated charged particle beam toward the same target. The particle beams may be bent through an orbit chamber. Two separate passages may be defined through at least part of the orbit chamber, one for charged particles having each energy.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: In accordance with an embodiment, a method of examining contents of objects comprises accelerating a plurality of electrons to a predetermined acceleration energy and colliding the accelerated electrons with a target. An object is scanned with the generated X-ray photons. First energies of X-ray photons are determined after scanning and second energies of accelerated electrons are determined after colliding with the target, and correlated. Energies of respective detected X-ray photons prior to scanning are determined based, at least in part, on the second energies of respective correlated accelerated electrons and the predetermined acceleration energy. A potential presence of suspect material is determined based, at least in part, on the first energies of respective X-ray photons after scanning and the third energies of the detected X-ray photons prior to scanning. Systems are also disclosed.

Abstract: A flexible circuit comprises a folded dielectric sheet having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The dielectric sheet is folded 180° about a selected axis and a bond layer joins the two halves over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers. The folded flex design is particularly suitable for reel-to-reel manufacturing.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The conductive patterns include a series of electrical contacts adjacent to one edge of the substrate. The substrate is bonded to two rigid frames, one on each opposite surface. Each substrate has a series of castellations on one edge that are aligned and electrically connected to the respective contacts on the substrate, preferably by soldering. The castellations can serve as a self-aligning mechanism when the module is brought into contact with a low-profile pin array, and the module may be held in place on a motherboard by guide rails in a socket that engages the edges perpendicular to the castellated edge of the module. The module may further be provided with protective heat spreading covers.

Abstract: A multichip module comprises a flexible circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. The flexible circuit is enclosed and supported by two rigid frames, which may further be provided with protective heat spreading covers. Contact pads on the rigid frame(s) may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

Abstract: A flexible circuit comprises two flexible dielectric sheets having conductive patterns on their surface(s) to which microelectronic device(s) are attached. A bond layer joins the two sheets over a portion of their respective surface areas so that a remaining portion of their areas remain unbonded and a bifurcated structure is thereby formed. Electrical contacts are provided on the unbonded or bifurcated portions of the flexible sheets. The flex may be attached to a rigid frame and provided with protective heat spreading covers.

Abstract: A socket assembly for multichip in-line modules comprises: at least three parallel in-line sockets, one of which is an edge-card socket adapted to matably engage electrodes on the edge of a printed circuit board, and the others of which are module sockets adapted to accept multichip in-line modules; and, internal connections between respective pins in each of the parallel sockets, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules. Alternatively, a socket assembly for multichip in-line modules comprises: a substantially rigid housing structure; at least two parallel in-line sockets adapted to accept multichip in-line modules; a set of electrodes adapted for soldering to a printed circuit board; and, internal connections between respective pins in each of the parallel sockets and the set of electrodes, whereby signals from the printed circuit board may be simultaneously carried to each of the multichip in-line modules.

Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.