Abstract: In various embodiments, high temperature printed circuit boards are disclosed. In one embodiment, a high temperature printed circuit board (PCB) comprises a first reinforced pre-impregnated layer and a second reinforced pre-impregnated layer. The first reinforced pre-impregnated layer and the second reinforced pre-impregnated layer comprise a plurality of glass fibers having a warp and a weft and impregnated with a polyimide high-temperature resin adhesive. A flexible metal-clad polyimide laminate material is located between the first reinforced pre-impregnated layer and the reinforced second pre-impregnated layer. The flexible metal-clad polyimide laminate material comprises a plurality of conductive traces. A polyimide film is disposed over the first pre-impregnated layer and the second pre-impregnated layer.

Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.

Abstract: A multilayer rigid flex printed circuit board wherein the board laminate comprises a basestock composite containing a flexible core, formed by laminating a first conductive layer to a flexible insulator layer, a second insulator layer affixed to the basestock, said second insulator layer having a cutout region proximate to the flexible core of the basestock composite to expose a portion of said first conducting layer on said flexible core, a second conductive layer attached to said second insulator layer said second conductive layer having a cutout region proximate to the flexible core of the basestock composite, and a photo-imageable soldermask applied to the exposed portion said first conducting layer, and to the second conductive layer, wherein said photoimageable soldermask allows for photo definition of openings on the conductive layers to which it is applied.

Abstract: A rigid flex printed circuit board wherein the flex section of said board comprises a basestock composite with edges formed by laminating a conductive layer to a flexible insulator layer, the conductor layer containing at least one conductive pathway and the flexible insulator layer comprises fibers dispersed in a matrix polymer. The fibers are oriented with respect to the conductive pathway so that the conductive pathway is substantially non-aligned with said fibers, substantially along an entirety of the conductive pathway in the flex section so as to be flexible.