Abstract: A thin, direct bond copper ceramic substrate of high strength and good thermal conductivity and suitable for high temperature thick film processing is described. It comprises two outer layers of alumina of equal thickness and matching dimensions for bending stress equalization, and an inner copper core, itself formed of three component layers, bonded by a copper oxygen eutectic between the layers of alumina. The thickness of the copper core is held between one-tenth and one-third the thickness of the substrate. The laminated structure, which permits recycling for high temperature thick film processing, sustains stresses at working temperatures, strengthening the substrate, and provides high thermal conductivity for heat management in a high density environment.

Abstract: A lubrication system for a gearbox having a forced flow of lubricant around one or more flow loops using dynamic forces imparted to the lubricant by a major element, preferably one primarily serving another function, which acts as a pump and cooperates with the gearbox casing to provide a dynamic reservoir. The primary lubrication flow loop includes an efficient flow diverter to feed a lubricant distribution reservoir, dispensers, predetermined regulated flow paths to critical items and a centrifugal separator built into the pump to deaerate the lubricant.