Patents by Inventor James E. Vianco, Sr.

James E. Vianco, Sr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fluid ejection assembly having a mounting substrate
    Patent number: 8118406
    Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.
    Type: Grant
    Filed: October 5, 2009
    Date of Patent: February 21, 2012
    Assignee: Eastman Kodak Company
    Inventors: Mario J. Ciminelli, James E. Vianco, Sr., Dwight J. Petruchik
  • FLUID EJECTION ASSEMBLY HAVING A MOUNTING SUBSTRATE
    Publication number: 20110080450
    Abstract: The present invention relates to a fluid ejection assembly that includes an injection-molded mounting substrate that is formed by a two-shot injection molding process, wherein a housing portion of the mounting substrate is formed by a first shot molding, and a die-attach portion of the mounting substrate is formed within the housing portion by a second shot molding. The die-attach portion is made of a material having a low coefficient of thermal expansion along a direction that is parallel to a fluid passageway in the die attach portion.
    Type: Application
    Filed: October 5, 2009
    Publication date: April 7, 2011
    Inventors: Mario J. Ciminelli, James E. Vianco, SR., Dwight J. Petruchik