Patents by Inventor James F. Landers, Jr.

James F. Landers, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Transparent compound and applications for its use
    Patent number: 6246123
    Abstract: A mold compound made from a polymer resin and an isorefringent, transparent filler is used to form optical electronic components (10, 20, 30). The mold compound can be used to form a lens (13) on a display device (10), to form the outer housing (21) of a waveguide (20), or to form a dome (34) that reflects light from a light emitting device (32) to a light detecting device (33).
    Type: Grant
    Filed: May 4, 1998
    Date of Patent: June 12, 2001
    Assignee: Motorola, Inc.
    Inventors: James F. Landers, Jr., Robert K. Denton, Jr.
  • RF absorbing ablating apparatus
    Patent number: 4748449
    Abstract: A microwave absorbing ablating material is used as the ablative covering between the transmitting and receiving antennas while a standard ablating material, allowing the transmission of signals, is placed about the antennas. This allows signals to be transmitted from and received by the object covered by RF absorbing ablating material while preventing the transmission of signals transversely through the material. The RF absorbing, ablating material is made by combining an RF absorbing material with an ablating material in sufficient quantities to absorb and dissipate any signals that may be exposed to the ablative material.
    Type: Grant
    Filed: April 2, 1984
    Date of Patent: May 31, 1988
    Assignee: Motorola, Inc.
    Inventors: James F. Landers, Jr., R. Gordon Graham, Theodore Harp, III
  • Method for potting and encapsulating electronic circuits
    Patent number: 4293519
    Abstract: A method for potting and encapsulating electronic circuits by providing a homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, intermixing the resin-curing agent and microspheres in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight, enclosing the electronic circuit with a form, pouring the homogeneous mixture in the form to surround one electronic circuit, and heating the mixture to the required temperature for curing.
    Type: Grant
    Filed: October 4, 1979
    Date of Patent: October 6, 1981
    Assignee: Motorola Inc.
    Inventors: Thomas A. Knappenberger, James F. Landers, Jr.
  • Potting and encapsulating material for electronic circuits
    Patent number: 4231916
    Abstract: A homogeneous mixture of uncured thermosetting resin and curing agent in a flowable powder form with a particle size in the range of approximately 60 mesh to 200 mesh and curable in a range of approximately 125.degree. F. to 212.degree. F., and hollow microspheres having a diameter in the range of approximately 5 microns to 300 microns, with the resin-curing agent and microspheres being intermixed in a ratio in the range of approximately 35 percent to 45 percent resin-curing agent to microspheres by weight.
    Type: Grant
    Filed: October 16, 1979
    Date of Patent: November 4, 1980
    Assignee: Motorola, Inc.
    Inventors: Thomas A. Knappenberger, James F. Landers, Jr.