Abstract: The invention provides for methods of detecting and treating diseased tissue, particularly in skin diseases or disorders, such as psoriasis, scleroderma, eczema or atopic dermatitis tissue. The method involves administrating a composition comprising an antibody specific to the diseased tissue to a patient. After administration, the antibody in the composition binds to the exposed cell surface antigen (epitope) and allows the detection and/or disrupts the growth of the diseased tissue.

Abstract: A method of fabrication are provided in which permanent external electrical connection to active circuitry in a semiconductor structure can be made through either a wire bond pad or metal bump formed thereon. A final metallization including a wire bond pad is disposed over and electrically connected with the active circuitry. An insulating material film is disposed over the final metallization leaving the wire bond pad and a portion of the final metallization laterally displaced from the pad exposed. A metal bump contacts the laterally displayed exposed portion of the final metallization. The wire bond pad is electrically coupled with and laterally displaced from the metal bump through the final metallization. The metal bump and wire bond pad are configured to facilitate electrical connection of the semiconductor structure with an external connector, such as a modular packaging substrate.

Abstract: A semiconductor structure and method of fabrication are provided in which permanent external electrical connection to active circuitry in the structure can be made through either a wire bond pad or metal bump formed thereon. A final metallization including a wire bond pad is disposed over and electrically connected with the active circuitry. An insulating material film is disposed over the final metallization leaving the wire bond pad and a portion of the final metallization laterally displaced from the pad exposed. A metal bump contacts the laterally displaced exposed portion of the final metallization. The wire bond pad is electrically coupled with and laterally displaced from the metal bump through the final metallization. The metal bump and wire bond pad are configured to facilitate electrical connection of the semiconductor structure with an external connector, such as a modular packaging substrate.