Abstract: A bond film includes a thermoplastic polyimide adhesive that contains particles which are thermally conductive and electrically conductive particles. A conductive foil layer may be placed between two layers of adhesive to form the bond foil. This bond film has a low curing temperature which reduces CTE mismatch between different substrates and therefore allows direct bonding of substrates that have high coefficient of thermal expansion mismatch. The low curing temperature also allows for reduced processing costs. The conductive bond film does not degrade at high temperatures, allowing for service temperatures up to 350° C. and thermal excursions up to 450° C.

Abstract: A system for causing investment returns for individual investors in a fund to correspond to occurrence of selected events with respect to investment options selected by said individual investors, the system including instructions for: defining a plurality of said investment options each having a yield calculator, said calculator having a value related to occurrence of predefined events; selecting a nominal yield of said fund; allocating a portion of said nominal yield to each of said investment options ratably with respect to the portion of said value of each said yield calculator bears to all values of said yield calculators; calculating, on a periodic basis, a change in total value of assets owned by said fund and ratably allocating said change to investors in said fund; and periodically redetermining said values in each of said yield calculators by measuring occurrence of said predefined events during a selected measuring period.

Abstract: A system for causing investment returns for individual investors in a fund to correspond to occurrence of selected events with respect to investment options selected by said individual investors, the system including instructions for: defining a plurality of said investment options each having a yield calculator, said calculator having a value related to occurrence of predefined events; selecting a nominal yield of said fund; allocating a portion of said nominal yield to each of said investment options ratably with respect to the portion of said value of each said yield calculator bears to all values of said yield calculators; calculating, on a periodic basis, a change in total value of assets owned by said fund and ratably allocating said change to investors in said fund; and periodically redetermining said values in each of said yield calculators by measuring occurrence of said predefined events during a selected measuring period.

Abstract: A method for manufacturing a printed circuit bonded to a heat sink includes producing the printed circuit comprising at least one conductive layer circuit pattern laminated to at least one side of a dielectric layer; first adhering a first side of a bond film to the printed circuit, wherein the first adhering conforms the printed circuit to the bond film to substantially remove air entrapment between the printed circuit and the bond film; and second adhering a second side of the bond film to the heat sink, wherein the first adhering and the second adhering bond the heat sink to the printed circuit.

Abstract: A method for manufacturing a printed circuit bonded to a heat sink includes adhering a conductive layer to a bond film using a first adhesive layer to produce a circuit substrate; processing the circuit substrate to produce a flexible printed circuit; and laminating the heat sink to a second surface of the bond film of the flexible printed circuit using a second adhesive layer. Another method for manufacturing a flexible printed circuit includes placing a release sheet between a first bond film and a second bond film; adhering a first conductive layer to the first bond film to produce a first circuit substrate; adhering a second conductive layer to the second bond film to produce a second circuit substrate; processing the first and the second circuit substrates each to produce a flexible printed circuit; and removing the release sheet. The method may further include laminating the flexible printed circuit to a heat sink.

Abstract: A circuit assembly includes a substrate layer, a first conductive layer mounted to the substrate layer and a second conductive layer. The first and second conductive layers are adhered by an adhesive layer having non-electrically conductive particles for separating the first and second conductive layers.

Abstract: Solderable structures, and related methods for making them, can provide thermal conductivity and/or electrical isolation for electronic devices soldered to the structures. Each of the structures includes a solderable material bonded to a heat sink by a thermally-activated bonding material which provides thermal conductivity between the solderable material and the heat sink and which can be configured as a three-layer bonding film to also provide electrical isolation. The structures can be produced in a highly-automated, rapid way without the need for standard mounting hardware and mechanical preparation of the heat sinks.

Abstract: A flexible laminate for use in flexible circuitry including at least one layer of a flexible film substrate; at least one layer of a metal foil on top of the flexible film substrate; and an adhesive including a polyetherimide, and preferably a siloxane polyetherimide copolymer, present between said flexible film substrate and said metal foil; in which the adhesive bonds the metal foil to the flexible film substrate.