Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated until it is liquid, wherein the excess solder is wicked vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

Abstract: A vibrato device for a guitar which allows a guitarist to maintain the relative pitch on each string when using the vibrato arm. The vibrato device consists of a string deflection assembly, a fixed deflection mounted to the top surface of a guitar, and a pivoting tension assembly located inside the guitar. The deflection assembly includes a deflection plate which includes a plurality of longitudinally aligned grooves and six horizontal holes for the saddles to sit over. Adjustable saddles with longitudinally aligned teeth formed on their bottom surface are placed over the deflection plate and engage the grooves. During use, the strings pass over the saddles and force the teeth to engage the grooves to securely hold the saddles in place over the deflection plate thereby eliminating the need for screws. The tension assembly includes a string attachment member and a support bracket.