Patents by Inventor JAMES HIROSHI AKAO

JAMES HIROSHI AKAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10838026
    Abstract: In one example, an RF coil array includes a first RF coil configured to generate a magnetic field along a first axis, the first RF coil having a first surface, a second RF coil configured to generate a magnetic field along a second axis, orthogonal to the first axis, the second RF coil having a second surface, and a first foldable interconnect coupling the first RF coil to the second RF coil. The first foldable interconnect may be adjusted to couple the first RF coil to the second RF coil with a first amount of overlap and with the first surface and second surface facing a common direction, or couple the first RF coil to the second RF coil with a second amount of overlap, larger than the first amount of overlap, and with the first surface in face to face position with the second surface.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: November 17, 2020
    Assignee: GENERAL ELECTRIC COMPANY
    Inventors: Dashen Chu, Scott Allen Lindsay, Dawei Gui, James Hiroshi Akao, Zhu Li
  • Publication number: 20190056466
    Abstract: In one example, an RF coil array includes a first RF coil configured to generate a magnetic field along a first axis, the first RF coil having a first surface, a second RF coil configured to generate a magnetic field along a second axis, orthogonal to the first axis, the second RF coil having a second surface, and a first foldable interconnect coupling the first RF coil to the second RF coil. The first foldable interconnect may be adjusted to couple the first RF coil to the second RF coil with a first amount of overlap and with the first surface and second surface facing a common direction, or couple the first RF coil to the second RF coil with a second amount of overlap, larger than the first amount of overlap, and with the first surface in face to face position with the second surface.
    Type: Application
    Filed: October 22, 2018
    Publication date: February 21, 2019
    Inventors: Dashen Chu, Scott Allen Lindsay, Dawei Gui, James Hiroshi Akao, Zhu Li
  • Patent number: 10132883
    Abstract: In one example, an RF coil array includes a first RF coil configured to generate a magnetic field along a first axis, the first RF coil having a first surface, a second RF coil configured to generate a magnetic field along a second axis, orthogonal to the first axis, the second RF coil having a second surface, and a first foldable interconnect coupling the first RF coil to the second RF coil. The first foldable interconnect may be adjusted to couple the first RF coil to the second RF coil with a first amount of overlap and with the first surface and second surface facing a common direction, or couple the first RF coil to the second RF coil with a second amount of overlap, larger than the first amount of overlap, and with the first surface in face to face position with the second surface.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: November 20, 2018
    Assignee: General Electric Company
    Inventors: Dashen Chu, Scott Allen Lindsay, Dawei Gui, James Hiroshi Akao, Zhu Li
  • Publication number: 20170343625
    Abstract: In one example, an RF coil array includes a first RF coil configured to generate a magnetic field along a first axis, the first RF coil having a first surface, a second RF coil configured to generate a magnetic field along a second axis, orthogonal to the first axis, the second RF coil having a second surface, and a first foldable interconnect coupling the first RF coil to the second RF coil. The first foldable interconnect may be adjusted to couple the first RF coil to the second RF coil with a first amount of overlap and with the first surface and second surface facing a common direction, or couple the first RF coil to the second RF coil with a second amount of overlap, larger than the first amount of overlap, and with the first surface in face to face position with the second surface.
    Type: Application
    Filed: May 31, 2016
    Publication date: November 30, 2017
    Inventors: Dashen Chu, Scott Allen Lindsay, Dawei Gui, James Hiroshi Akao, Zhu Li
  • Publication number: 20170003367
    Abstract: A method of parallel imaging for use with a magnetic resonance imaging apparatus includes producing a longitudinal magnetic field B0 throughout a target volume, producing a transverse magnetic field B1 that is generally perpendicular to B0 throughout the target volume, transmitting a plurality of RF pulses to the target volume, with a surface coil, acquiring first MRI data from a target within the target volume in response to the transmission of RF pulses, and with a body coil, acquiring second MRI data from the target within the target volume in response to the transmission of RF pulses, wherein acquisition of the first MRI data and the second MRI data occurs substantially simultaneously.
    Type: Application
    Filed: June 30, 2015
    Publication date: January 5, 2017
    Applicant: GENERAL ELECTRIC COMPANY
    Inventors: DASHEN CHU, ROBERT STEVEN STORMONT, SCOTT ALLEN LINDSAY, JAMES HIROSHI AKAO, ZHU LI, HAI ZHENG, XIAOXU LIU