Patents by Inventor James Hjerpe Kaskade

James Hjerpe Kaskade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for providing power to a microprocessor with integrated thermal and EMI management
    Patent number: 6452113
    Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: September 17, 2002
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph Ted Dibene, II, David H. Hartke, James Hjerpe Kaskade, Carl E. Hoge