Abstract: A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Abstract: A channel is created within a planar layer. At least a portion of an optical path is formed within the channel. An optical core medium may be deposited into the channel. In various embodiments, reflective layers are deposited within and over the channel to form the optical path. In another embodiment, a photosensitive sheet is exposed to an optical path mask in the presence of an optical source to define an optical path lying within the plane of the sheet.

Abstract: An optical cross connect includes first and second planar layers having m and n optical path(s), respectively. An optical switch array comprising a plurality of optical switches is disposed to enable optically coupling any optical path of the first planar layer with any optical path of the second planar layer. Techniques for creating a variety of optical path types are provided.

Abstract: A signal routing circuit board has electronics common to circuit boards coupled to the signal routing circuit board. The signal routing circuit board may be coupled to a storage array circuit board and at least one input/output (I/O) controller circuit board. The storage array circuit board has storage device connectors to couple storage devices to the storage array circuit board.

Abstract: A connection architecture for a data-storage system may include: a connection-plane structure; a data-storage module attached to, and drawing power from, the connection-plane structure; an input/output (I/O) module attached to, and drawing power from, the connection-plane structure; and wireless means for exchanging data wirelessly between the data-storage module and the I/O module.

Abstract: A method of forming an optical communication path includes forming an optical path for carrying optical communications. An electrically conductive cladding is formed along the optical path for carrying at least one of electrical power, control, and data along the optical path.

Abstract: A method for fabricating a filament-affixed trace within an electronic device, such as a circuit board or microelectronic device. Conductive traces are affixed to the surface of a composite substrate containing filaments in a matrix bonded to an underlying solid material. The matrix is then removed, leaving the conductive traces suspended or supported by filaments. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A backplane apparatus for an electronic device enclosure includes a common bus comprising a plurality of signal lines, each signal line having a current limiting element, RA. Isolation circuitry is provided for electrically coupling each of the plurality of signal lines of the common bus to a corresponding plurality of signal lines of the electronic device to enable signal communication between the common bus and the electronic device through the isolation circuitry. In one embodiment, the backplane apparatus further comprises connectors to enable removably attaching the electronic devices such as disk drives. In one embodiment, the isolation circuitry coupling each signal line of the common bus to the connector comprises an inline resistor, RD. The isolation circuitry associated with some of the signal lines may include pull up resistors.

Abstract: A connection architecture for a data-storage system may include: a connection-plane structure; a data-storage module attached to, and drawing power from, the connection-plane structure; an input/output (I/O) module attached to, and drawing power from, the connection-plane structure; and wireless means for exchanging data wirelessly between the data-storage module and the I/O module.

Abstract: A method and apparatus is provided for reducing electromagnetic radiation emissions. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of a system assembly from interfering with and adversely affecting electrical circuits in the assembly. An electromagnetic compatibility (EMC) solution uses a lossy element, and/or an element comprised of a combination of lossy and conductive material.

Abstract: Apparatus for connecting a plurality of electronic devices with corresponding backplanes to improve reliability of accessing the devices are described. In one embodiment, the apparatus includes first and second backplanes having connectors for at least one device. A device having a plurality of data paths has a first data path coupled to a data path connector of the first backplane. A second data path of the device is coupled to a data path connector of the second backplane. Alternatively, a Y-adapter is used to connect a single data path device to data path connectors of distinct backplanes. In various embodiments, the backplanes lie in a common plane. Alternatively, the backplanes lie in distinct parallel planes.

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A bus controller card capable of communicating high speed data between at least one host computer and at least one peripheral comprises a first bus segment connected between a first host connector, a first expander, a first card controller, a second expander, and a second host connector. A second bus segment extends from the first expander to a first backplane connector. A third bus segment extends from the second expander to a second backplane connector. At least one monitor bus segment is provided on the backplane to directly connect the first card controller to a second card controller on another bus controller card in the system.

Abstract: An enclosure for a storage system includes a housing, redundant power supply slots for receiving one or more power supplies, redundant fan slots for receiving one or more fan cards, and redundant bus controller card slots for receiving one or more bus controller cards. The redundant controller card slots have a first backplane connector for coupling to an odd bus and a second backplane connector for coupling to an even bus. The odd bus and the even bus are accessible independently through the enclosure.

Abstract: An interface card includes a plurality of data paths with each data path extending from a first connector to a second connector. The second connector for coupling to a bus backplane. One or more of the data paths include a transceiver that accesses signals in a first bus signaling type, an isolator/converter that mutually isolates the plurality of data paths and that converts signals from the first bus signaling type to a second bus signaling type, and a bridge coupled from a first data path to a second data path of the plurality of data paths. The bridge is capable of controlling communication of signals between the first data path and the second data path.

Abstract: A circuit board or microelectronic device in which conductive signal lines are suspended or supported by filaments in air, rather than surrounded by a solid dielectric material. Dry air has a low relative permittivity and extremely low loss tangent compared with common dielectric substrates in which signal lines are currently embedded within circuit boards and microelectronic devices. The signal intensity attenuation for filament-suspended or filament-supported signal lines is much lower than signal lines embedded in solid dielectric materials, allowing for transmission of significantly higher frequency signals within filament-suspended and filament-supported signal lines.

Abstract: A method and apparatus is provided for reducing electromagnetic radiation emissions. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of a system assembly from interfering with and adversely affecting electrical circuits in the assembly. An electromagnetic compatibility (EMC) solution uses a lossy element, and/or an element comprised of a combination of lossy and conductive material.

Abstract: A method and apparatus is provided for reducing electromagnetic radiation emissions. The method and apparatus of the present invention also reduce or prevent electromagnetic radiation generated by sources outside of a system assembly from interfering with and adversely affecting electrical circuits in the assembly. An electromagnetic compatibility (EMC) solution uses a lossy element, and/or an element comprised of a combination of lossy and conductive material.

Abstract: A method of finishing an enclosure formed from sheet metal includes the step of providing a tube formed from a film of a heat shrink polymer. The enclosure is inserted into the tube. Heat is applied to shrink the tube about the enclosure. Another method of finishing the enclosure includes the step of providing a sheet of a heat shrink polymer. The sheet is wrapped about the enclosure. The wrapped sheet may be affixed to the enclosure mechanically, chemically, or some combination thereof. Heat is applied to shrink wrap the sheet about the enclosure. In various embodiments the heat shrink polymer comprises at least one of the following polymers: irradiated low density polyethylene (LDPE), polyolefin, poly-ethylene terephthalate (PET), poly-vinyl chloride (PVC), and fluoropolymers such as poly-tetrafluoroethylene (PTFE), poly-vinylidene di-fluoride (PVDF), fluoroethylenepropylene (FEP), and perfluoroalkoxy (PFA).

Abstract: Blower designs for vented enclosures include an impeller having a plurality of blades. The impeller includes a plurality of blades pivotably coupled to an impeller body. The blades pivot to enable operation in one of a closed and an open state. Air flow between blades is substantially restricted when the blades are in the closed state. Air flow between the blades is permitted when the blades are in an open state. In one embodiment, the pivotable couplings are spring loaded to maintain the blades in the closed state when the impeller rotational speed is below a threshold range. The blades pivot to the open state when the rotational speed exceeds the threshold range.