Abstract: An electrical package for Large Scale Integrated (LSI) devices includes a carrier having (a) thermal expansion similar to a semiconductor, (b) a standard array of terminal pins (100 or more) and (c) a circuit transposer that is (i) a semiconductor material, typically silicon and (ii) readily personalized to connect any combination of attached LSI devices to the input-output terminal pins. The package utilizes solder technology to interconnect the carrier, circuit transposer and LSI devices. The carrier and semiconductor transposer eliminate mechanical stress on the solder joints that would otherwise occur from thermal coefficient expansion (TCE) mismatch between dissimilar package materials. The circuit transposer increases the wirability of electrical packages utilizing solder technology. Reliability problems presented by thick film paste or metallized conductors on carriers are also overcome by the semiconductor circuit transposer.

Abstract: The present invention relates to a latch for detachably securing electron cards along orthogonal loading axes. A planar fixed gate is rigidly securable to an external supporting structure and is provided with at least one elongated protrusion extending above one of the planar surfaces. A planar movable gate is rigidly securable to an external electronics mountable structure wherein said movable gate is provided with at least one elongated groove on a planar surface. The planar fixed gate and the planar movable gate are abuttingly engageable to each other with the protrusion matingly fitted within the corresponding groove. The orientation of the protrusion and groove are orthogonal to an axis of a first loading force applicable to the moving gate. A fastener such as a threaded bolt rigidly maintains the planar surfaces of the fixed gate in engagement with the movable gate for rigid support along a second loading axis orthogonal to the first loading axis.