Abstract: A circuit chip package and method for assembling the same is disclosed which employs low eutectic or melting point solder, such as an indium alloy, as a thermally conductive medium between each circuit chip and the package cover. The melting point of the solder is selected above the highest normal operating temperature of the chips but below a temperature which would damage the chips or their interconnects. To assemble the package, the housing cover, which has one or more solder receptacles formed therein, is inverted and partially filled with liquid solder. A base containing the circuit chips and interconnects is then attached to the cover so that the top portions of the chips or extensions on the chips are partially dipped into the solder. The solder is then allowed to cool and solidify and thereby automaticaly accommodates for chip to housing dimensional variations. The package can be easily disassembled by passing warm fluid over the package to cause the solder to reliquify.

Abstract: Disclosed are a method and apparatus for delivering a solvent in the liquid state to a surface to be cleaned. The volume of the solvent and the time interval during which it is applied to the surface are selected so that the solvent reaches the surface in the liquid state. In a preferred embodiment, the solvent is water which is sprayed at selected time intervals onto the lower surface of the distributor plate supporting a fluidized bed of glass batch material for preheating.

Abstract: A series of operatively interconnected fuel flow regulators are adapted to meter and direct the flow of particulate fuel from a fuel conveying system into the burners of a furnace or kiln. Each regulator is fed by a conveying system and includes a feeder housing having a flow metering impeller and feed rotor arrangement. Each housing includes an adjustable fuel orifice communicating with a respective burner.

Abstract: An apparatus and method for determining the elevation of the fusion interface between batch and molten glass in an electric glass-melting furnace is disclosed. A probe is driven vertically downwardly through the batch by a combination of a motorized drive assembly and a pneumatic hammer device. When the bottom tip of the probe penetrates the fusion interface, a current path is established from a furnace electrode through the molten glass to the probe tip, with such current flow thereby giving indication that the probe tip has descended to the elevation of the fusion interface.