Abstract: A thermal interface material for use in manufacturing a semiconductor component and a method for manufacturing the semiconductor component. The thermal interface material includes a metallic element in combination with either antimony or tin. Suitable metallic elements include gallium or indium. The concentration of antimony or tin is about 2 percent or less by weight of the thermal interface material. A semiconductor chip is mounted to a support substrate and the thermal interface material is disposed on the semiconductor chip. A lid or a heatsink is coupled to the semiconductor chip via the thermal interface material.

Abstract: A circuit module having a distance compensation element and a method for manufacturing the circuit module. A thinned semiconductor chip is mounted to a top surface of a support substrate. The thinned semiconductor chip has an upper surface that is spaced apart from the top surface of the support substrate by a first distance. A circuit element having an upper surface is mounted to the support substrate, wherein the upper surface of the circuit element is spaced apart from top surface of the support substrate by a second distance. A height compensation element is mounted over the thinned semiconductor chip and attached to the top surface of the support substrate. The height compensation element has a surface spaced apart from the top surface of the support substrate by a distance greater than or equal to the second distance.

Abstract: A restraining device (10 or 10a) adapted for holding slide carriers (14) immovable in magazines includes a top wall panel (34), at least two horizontal pleated panel sections (36a-36d), and a bottom wall panel (38) all joined together to define a hollow bellows-type structure.

Abstract: A PGA integrated circuit package includes a package substrate (12), a unidirectional electrically conductive elastomeric layer (14), a plastic tape layer (16) having a centrally disposed chip (18), an insulator layer (20), and a cover member (22). A plurality of metal terminal pins (24) extend from a bottom surface of the substrate (12) and protrude slightly above a top surface thereof to form terminal pin ends (30). The elastomeric layer (14) is deposited over the substrate (12) for engagement with the terminal pin ends (30). The tape layer (16) and the chip (18) are deposited over the elastomeric layer (14). The tape layer (16) has a metalized trace pattern deposited on its bottom surface. The metalized trace pattern terminates at its outer ends with spaced apart metal terminal pads (32) which are in substantially vertical alignment with the respective terminal pin ends (30).