Patents by Inventor James L. Jellison

James L. Jellison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6075220
    Abstract: An apparatus and method for determining the penetration of the weld pool created from pulsed laser welding and more particularly to an apparatus and method of utilizing an optical technique to monitor the weld vaporization plume velocity to determine the depth of penetration. A light source directs a beam through a vaporization plume above a weld pool, wherein the plume changes the intensity of the beam, allowing determination of the velocity of the plume. From the velocity of the plume, the depth of the weld is determined.
    Type: Grant
    Filed: February 12, 1998
    Date of Patent: June 13, 2000
    Assignee: Sandia Corporation
    Inventors: Marcelino Essien, David M. Keicher, M. Eric Schlienger, James L. Jellison
  • Patent number: 5827951
    Abstract: A new test method to quantify capillary flow solderability on a printed wiring board surface finish. The test is based on solder flow from a pad onto narrow strips or lines. A test procedure and video image analysis technique were developed for conducting the test and evaluating the data. Feasibility tests revealed that the wetted distance was sensitive to the ratio of pad radius to line width (l/r), solder volume, and flux predry time.
    Type: Grant
    Filed: April 21, 1995
    Date of Patent: October 27, 1998
    Assignee: Sandia National Laboratories
    Inventors: Fred Yost, Floyd M. Hosking, James L. Jellison, Bruce Short, Terri Giversen, Jimmy R. Reed
  • Patent number: 5409543
    Abstract: A system for chemically transforming metal surface oxides to metal that is especially, but not exclusively, suitable for preparing metal surfaces for dry soldering and solder reflow processes. The system employs one or more hot, refractory metal filaments, grids or surfaces to thermally dissociate molecular species in a low pressure of working gas such as a hydrogen-containing gas to produce reactive species in a reactive plasma that can chemically reduce metal oxides and form volatile compounds that are removed in the working gas flow. Dry soldering and solder reflow processes are especially applicable to the manufacture of printed circuit boards, semiconductor chip lead attachment and packaging multichip modules. The system can be retrofitted onto existing metal treatment ovens, furnaces, welding systems and wave soldering system designs.
    Type: Grant
    Filed: December 22, 1992
    Date of Patent: April 25, 1995
    Assignee: Sandia Corporation
    Inventors: Janda K. G. Panitz, James L. Jellison, David J. Staley
  • Patent number: 4992643
    Abstract: A method and apparatus for enhancing the weldment of a laser welding system is provided. The laser weld plume control device includes a cylindrical body defining an upside-down cone cavity; the upper surface of the body circumscribes the base of the cone cavity, and the vertex of the cone cavity forms an orifice concentrically located with respect to the laser beam and the plume which forms as a result of the welding operation. According to the method of the invention, gas is directed radially inward through inlets in the upper surface of the body into and through channels in the wall of the body and finally through the orifice of the body, and downward onto the surface of the weldment. The gas flow is then converted by the orifice of the device from radial flow to an axisymmetric gas jet flowing away from the weldment surface in a direction perpendicular to the surface and opposite to that of the laser.
    Type: Grant
    Filed: August 25, 1989
    Date of Patent: February 12, 1991
    Assignee: United States Department of Energy
    Inventors: Phillip W. Fuerschbach, James L. Jellison, David M. Keicher, William L. Oberkampf