Patents by Inventor James M. Broder

James M. Broder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated power delivery and cooling system for high power microprocessors
    Patent number: 6801431
    Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.
    Type: Grant
    Filed: November 8, 2002
    Date of Patent: October 5, 2004
    Assignee: Incep Technologies, Inc.
    Inventors: David J Hartke, Joseph T. Dibene, II, Edward J. Derian, James M. Broder
  • Apparatus for delivering power to high performance electronic assemblies
    Patent number: 6618268
    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: September 9, 2003
    Assignee: Incep Technologies, Inc.
    Inventors: Joseph T. Dibene, II, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel
  • Integrated power delivery and cooling system for high power microprocessors
    Publication number: 20030057548
    Abstract: The present invention is described as an integrated electronic assembly. The electronic assembly comprises a heat dissipating device, a power conditioning circuit board, a power dissipating device mounted on a substrate, and a power interconnect assembly. The power conditioning circuit board includes a first side thermally coupled to the heat dissipating device, a power conditioning circuit for producing a conditioned power signal, and an aperture. The power dissipating device has a top surface thermally coupled to the heat dissipation device through an aperture. The substrate includes at least one power conductor disposed proximate at least one of the edges of the substrate. The power interconnection assembly, which electrically couples the conditioned power signal to the substrate and provides substantially all power to the substrate, includes an edge connector assembly removably coupled to the at least one edge of the substrate.
    Type: Application
    Filed: November 8, 2002
    Publication date: March 27, 2003
    Applicant: INCEP Technologies, Inc.
    Inventors: David H. Hartke, Joseph Ted Dibene, Edward J. Derian, James M. Broder
  • Method and apparatus for delivering power to high performance electronic assemblies
    Publication number: 20010036066
    Abstract: A method, apparatus, and article of manufacture for providing power from a first circuit board having a first circuit board first conductive surface and a first circuit board second conductive surface to a second circuit board having a second circuit board first conductive surface and a second circuit board second conductive surface is described. The apparatus comprises a first conductive member, including a first end having a first conductive member surface electrically coupleable to the first circuit board first conductive surface and a second end distal from the first end having a first conductive member second surface electrically coupleable to the second circuit board first surface.
    Type: Application
    Filed: March 8, 2001
    Publication date: November 1, 2001
    Inventors: Joseph T. Dibene, David H. Hartke, Edward J. Derian, Carl E. Hoge, James M. Broder, Jose B. San Andres, Joseph S. Riel