Abstract: This invention discloses a method of forming a conductor on a copper conductor on a semiconductor interconnection surface. A paste of copper material is formed over at least a portion of the semiconductor interconnection surface. A laser beam is directed against the paste. The laser beam is moved along the paste in accordance with a pattern to define the conductor. The laser beam fires and sinters the paste to form the conductor. The remaining paste which remains unfired is removed. The surface and the fired paste is then maintained in an inert atmosphere while heated to a sufficient temperature to provide a high quality copper conductor on the surface.