Patents by Inventor James N. Humenik
James N. Humenik has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 8961905Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.Type: GrantFiled: March 15, 2013Date of Patent: February 24, 2015Assignee: Lenovo Enterprise Solutions (Singapore) Pte. Ltd.Inventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A. Eckberg, James N. Humenik, Kathleen A. McGroddy-Goetz, Scott Partington, Christopher F. Perrera, Marco G. Trivella, Timothy M. Wiwel
-
Patent number: 8686749Abstract: Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.Type: GrantFiled: April 30, 2010Date of Patent: April 1, 2014Assignee: International Business Machines CorporationInventors: Brian M. Erwin, David L. Gardell, James N. Humenik, Rajneesh Kumar, John Lawson
-
Patent number: 8641973Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.Type: GrantFiled: March 2, 2012Date of Patent: February 4, 2014Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A. Eckberg, James N. Humenik, Kathleen A. McGroddy-Goetz, Scott Partington, Christopher F. Perrera, Marco G. Trivella, Timothy M. Wiwel
-
Patent number: 8297222Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: October 31, 2007Date of Patent: October 30, 2012Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N Humenik, Mark J LaPlante, David C Long
-
Patent number: 8232636Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: GrantFiled: January 26, 2010Date of Patent: July 31, 2012Assignee: International Business Machines CorporationInventors: James N Humenik, Sushumna Iruvanti, Richard Langlois, Hsichang Liu, Govindarajan Natarajan, Kamal K Sikka, Hilton T Toy, Jiantao Zheng, Gregg B Monjeau, Mark Kapfhammer
-
Publication number: 20120160019Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.Type: ApplicationFiled: March 2, 2012Publication date: June 28, 2012Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Govindarajan NATARAJAN, Emmanuel DELAMARCHE, Eric A. ECKBERG, James N. HUMENIK, Kathleen A. MCGRODDY-GOETZ, Scott PARTINGTON, Christopher F. PERRERA, Marco G. TRIVELLA, Timothy M. WIWEL
-
Patent number: 8173071Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the at least one micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.Type: GrantFiled: August 29, 2006Date of Patent: May 8, 2012Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A Eckberg, James N Humenik, Kathleen A McGroddy-Goetz, Scott Partington, Christopher F Perrera, Marco G Trivella, Timothy M Wiwel
-
Publication number: 20110267084Abstract: Non-corrosive thermal interface materials for use in a test structure and method of use. The test structure includes a heat sink for dissipating heat away from a device under test. The test structure further includes a non-corrosive thermal interface material disposed between the heat sink and the device under test. The non-corrosive thermal interface material is capable of withstanding test conditions for at least 60 minutes for at least 115° C. without staining or leaving residue on the device under test after baking.Type: ApplicationFiled: April 30, 2010Publication date: November 3, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Brian M. ERWIN, David L. GARDELL, James N. HUMENIK, Rajneesh KUMAR, John LAWSON
-
Publication number: 20110180923Abstract: A frontside of a chip is bonded to a top surface of a chip carrier. Seal material is dispensed at a periphery of the top surface of the chip carrier. A solder TIM having a first side and a second side is provided. The first side of the TIM contacts a backside of the chip. A reflow is performed to melt the TIM. The second side of the TIM is bonded to a lid. The seal material is cured. The lid is attached to the top surface of the chip carrier. Backfill material is injected into a space between the top surface of the chip carrier and the lid. The backfill material abuts sides of the TIM. The backfill material is cured. TIM solder cracking and associated thermal degradation are mitigated.Type: ApplicationFiled: January 26, 2010Publication date: July 28, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: JAMES N. HUMENIK, SUSHUMNA IRUVANTI, RICHARD LANGLOIS, HSICHANG LIU, GOVINDARAJAN NATARAJAN, KAMAL K. SIKKA, HILTON T. TOY, JIANTAO ZHENG, GREGG B. MONJEAU, MARK KAPFHAMMER
-
Patent number: 7964237Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: August 21, 2003Date of Patent: June 21, 2011Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N. Humenik, Mark J. LaPlante, David C. Long
-
Patent number: 7908906Abstract: An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.Type: GrantFiled: August 29, 2006Date of Patent: March 22, 2011Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A Eckberg, James N Humenik, Kathleen A McGroddy-Goetz, Scott Partington, Christopher F Perrera, Marco G Trivella, Timothy M Wiwel
-
Patent number: 7894919Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: October 31, 2007Date of Patent: February 22, 2011Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N Humenik, Mark J LaPlante, David C Long
-
Patent number: 7887874Abstract: A method of dispensing a flowable conductive paste onto a greensheet from a dispensing apparatus comprising an orifice member having first and second surfaces and a bore therethrough between the surfaces, a pressurized chamber adjacent the orifice member first surface containing the paste, and a punch having a face movable through the orifice member bore. The method comprises positioning the punch outside the orifice member bore such that the punch face is spaced from the orifice member first surface, flowing a desired amount of paste onto the punch face, moving the paste on the punch face through the orifice member bore until the punch face extends beyond the orifice member second surface, and contacting the workpiece with the paste while still on the punch face to deposit the paste on the greensheet.Type: GrantFiled: October 31, 2007Date of Patent: February 15, 2011Assignee: International Business Machines CorporationInventors: Thomas Weiss, James N Humenik, Mark J LaPlante, David C Long
-
Patent number: 7684194Abstract: Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.Type: GrantFiled: June 4, 2008Date of Patent: March 23, 2010Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Raschid J. Bezama, David L. Gardell, James N. Humenik
-
Publication number: 20090303684Abstract: Systems and methods for cooling electronic devices via enhanced thermal conduction in the gap separating an electronic device from a heat sink are provided. In one embodiment, a system for cooling an electronic device comprises: a heat sink spaced from the integrated circuit by a gap; and a bubbler and an atomizer configured to feed a mixture comprising an atomized liquid and a carrier gas to the gap.Type: ApplicationFiled: June 4, 2008Publication date: December 10, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Govindarajan Natarajan, Raschid J. Bezama, David L. Gardell, James N. Humenik
-
Publication number: 20090109628Abstract: Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.Type: ApplicationFiled: October 30, 2007Publication date: April 30, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raschid J. Bezama, James N. Humenik, Sushumna Iruvanti, Govindarajan Natarajan
-
Patent number: 7344679Abstract: An apparatus and a method are disclosed for providing point of care testing for osmolarity of a bodily fluid. An apparatus is disclosed as having a fluid pathway passing through it for receiving and testing a sample fluid. The invention permits osmolarity testing of a sample fluid wherein the sample fluid has a volume of less than approximately 30 nL, and implements a method and device to measure fluid osmolarity in a clinical setting quickly and accurately, while also reducing evaporation of the fluid.Type: GrantFiled: October 14, 2005Date of Patent: March 18, 2008Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, James N. Humenik, Scott D. Partington, Srinivasa S. N. Reddy
-
Publication number: 20080057569Abstract: An apparatus, system and method for determining the osmolarity of a fluid. The system includes an apparatus having: a chip with a substantially planar top surface; a first circuit portion and a second circuit portion, each having a plurality of redundant electrically conductive lines disposed on the top surface; and a gap disposed between the first circuit portion and the second circuit portion, wherein a circuit is created when a fluid sample bridges the gap and connects the first circuit portion and the second circuit portion.Type: ApplicationFiled: August 29, 2006Publication date: March 6, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A. Eckberg, James N. Humenik, Kathleen A. McGroddy-Goetz, Scott Partington, Christopher F Perrera, Marco G. Trivella, Timothy M. Wiwel
-
Publication number: 20080057570Abstract: An apparatus, system, and method for determining the osmolarity of a fluid. The apparatus includes at least one micro-fluidic circuit and at least one electrical circuit disposed in communication with the at least one micro-fluidic circuit for determining a property of a fluid contained within the at least one micro-fluidic circuit.Type: ApplicationFiled: August 29, 2006Publication date: March 6, 2008Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Govindarajan Natarajan, Emmanuel Delamarche, Eric A. Eckberg, James N. Humenik, Kathleen A. McGroddy-Goetz, Scott Partington, Christopher F. Perrera, Marco G. Trivella, Timothy M. Wiwel
-
Patent number: 6955777Abstract: A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.Type: GrantFiled: January 7, 2003Date of Patent: October 18, 2005Assignee: International Business Machines CorporationInventors: Govindarajan Natarajan, Umar Ahmad, Raschid J. Bezama, James N. Humenik, John U. Knickerbocker, Rao V. Vallabhaneni