Patents by Inventor James P. Godschalx

James P. Godschalx has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210296120
    Abstract: The invention is a method comprising (a) providing a substrate having at least one recessed feature characterized by a width of less than about 0.3 microns and an aspect ratio of 5 or higher, (b) coating onto the substrate a composition comprising (i) a curable polymeric material, (ii) a thermally deactivatable gap-filling aid, and (iii) at least one solvent, (c) drying the coated substrate to remove the solvent, leaving a composition of cross-linkable polymeric material and gap-filling aid substantially filling the recessed feature, and (d) heating the coated substrate to cure the polymeric material and to de-activate the gap-filling aid, wherein the cured material has a glass transition temperature of no less than 300° C. and, preferably, a thermal stability temperature of at least 300° C.
    Type: Application
    Filed: April 15, 2004
    Publication date: September 23, 2021
    Inventors: Kenneth L. Foster, James P. GODSCHALX, Michael G. SIMMONDS
  • Publication number: 20150166825
    Abstract: A composition comprising: an epoxy resin, a curing agent; and a bimodal core shell rubber comprising a styrene butadiene core and a styrene-acrylonitrile shell is disclosed. The composition can then be used to make a varnish formulation.
    Type: Application
    Filed: November 1, 2012
    Publication date: June 18, 2015
    Inventors: James P. Godschalx, Lameck Banda, David A. Reuschle
  • Patent number: 8791222
    Abstract: This invention concerns a polymer coating composition for use as non-focal optical power limiting dye containing polymeric materials. This composition contains: (1) one or more Modified Polymers comprising a Polymer, such as a hyperbranched polymer family, especially HB-PCS, HB-PU, HB-PUSOX or PC with one or more of: a) reverse saturable dye (RSA), b) multi-photon absorption dye (MPA), c) an azo dye, or d) absorption dye, which dye is chemically bonded to the pendant groups of the Polymer (along its chain and/or termini) or which forms a part of the backbone of the Polymer; (2) carbon nanotubes (CNT) as optical power limiters (OPL); and (3) a self-focusing component.
    Type: Grant
    Filed: September 22, 2010
    Date of Patent: July 29, 2014
    Assignee: Oxazogen, Inc.
    Inventors: Abhijit Sarkar, Petar R. Dvornic, James P. Godschalx
  • Publication number: 20120194932
    Abstract: This invention concerns a polymer coating composition for use as non-focal optical power limiting dye containing polymeric materials. This composition contains: (1) one or more Modified Polymers comprising a Polymer, such as a hyperbranched polymer family, especially HB—PCS, HB—PU, HB—PUSOX or PC with one or more of: a) reverse saturable dye (RSA), b) multi-photon absorption dye (MPA), c) an azo dye, or d) absorption dye, which dye is chemically bonded to the pendant groups of the Polymer (along its chain and/or termini) or which forms a part of the backbone of the Polymer; (2) carbon nanotubes (CNT) as optical power limiters (OPL); and (3) a self-focusing component. This Modified Polymer composition contains the dye incorporated into the polymer chain backbone or chemically bonded to the terminal groups at the ends or along the chain of the polymer, which provides efficient protection from laser beam damage along with its self-focusing mechanism.
    Type: Application
    Filed: September 22, 2010
    Publication date: August 2, 2012
    Applicant: OXAZOGEN, INC.
    Inventors: Abhijit Sarkar, Petar R. Dvornic, James P. Godschalx
  • Patent number: 8044214
    Abstract: A process for preparing isoxazole compounds of formula I: in which a nitroaryl of the formula (II): is contacted with an alkyl acetoacetate of the formula (III) or a salt thereof: in the presence of an activating agent and a base to provide the isoxazole compound.
    Type: Grant
    Filed: August 12, 2009
    Date of Patent: October 25, 2011
    Assignees: ANGUS Chemical Company, Dow Global Technologies LLC
    Inventors: James P. Godschalx, G. David Green
  • Publication number: 20100048910
    Abstract: A process for preparing isoxazole compounds of formula I: in which a nitroaryl of the formula (II): is contacted with an alkyl acetoacetate of the formula (III) or a salt thereof: in the presence of an activating agent and a base to provide the isoxazole compound.
    Type: Application
    Filed: August 12, 2009
    Publication date: February 25, 2010
    Inventors: James P. Godschalx, G. David Green
  • Patent number: 7635741
    Abstract: This invention is a monomer comprising at least two dienophile groups and at least two ring structures which ring structures are characterized by the presence of two conjugated carbon-to-carbon double bonds and the presence of a leaving group L, wherein L is characterized that when the ring structure reacts with a dienophile in the presence of heat or other energy sources, L is removed to form an aromatic ring structure. This invention is also curable oligomers and polymers and highly cross-linked polymers made with such monomers. Moreover, this invention is a method of making porous films by combining such monomers or their oligomers with a porogen, curing the polymer and removing the porogen.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: December 22, 2009
    Inventors: Q. Jason Niu, Robert E. Hefner, Jr., James P. Godschalx, James T. Pechacek, Kim E. Arndt
  • Publication number: 20090149561
    Abstract: Extruded polymer foams are prepared using 5,5-bis(bromomethyl)-2-oxo-1,3,2-dioxaphosphorinane or brominated 2-oxo-1,3,2-dioxaphosphorinane compounds. The brominated FR additives unexpectedly are stable at the extrusion temperatures, and provide excellent flame retardancy to the foams.
    Type: Application
    Filed: December 10, 2008
    Publication date: June 11, 2009
    Inventors: Anteneh Z. Worku, William G. Stobby, Sheila M. Tinetti, Inken Beulich, David R. Wilson, Duane R. Romer, James P. Godschalx, Nelson G. Rondan, William J. Kruper, JR., Ted A. Morgan
  • Patent number: 7399504
    Abstract: The present invention relates to a method for preparing polymeric films, preferably electroactive films, with enhanced physical properties by the steps of applying to a substrate a solution of a polymer containing pendant labile solubilizing groups, then removing the solvent and a sufficient concentration of the labile solubilizing groups render the polymer less soluble in the solvent than before the labile groups were removed. It is believed that the removal of pendant soluble groups a) permits optimization of the semiconducting backbone for charge transport performance, b) allows direct control of microstructure in the final film, and c) renders the final film more robust during subsequent process steps needed to construct multilayer devices.
    Type: Grant
    Filed: September 8, 2004
    Date of Patent: July 15, 2008
    Assignee: Dow Global Technologies Inc.
    Inventors: Mitchell Gene Dibbs, Michael Inbasekaran, Paul Henson Townsend, III, Kenneth L. Foster, Shaoguang S. Feng, David J. Brennan, Q. Jason Niu, James P. Godschalx, Dean M. Welsh, Ray E. Drumright
  • Publication number: 20080142930
    Abstract: A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
    Type: Application
    Filed: February 21, 2008
    Publication date: June 19, 2008
    Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, DOW GLOBAL TECHNOLOGIES, INC.
    Inventors: Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen
  • Patent number: 7381850
    Abstract: A monomer suitable for use in forming low dielectric constant films in semiconductor devices comprising i) two dienophile groups (A-functional groups) attached to a single aromatic ring and ii) a second ring structure comprising two conjugated carbon-to-carbon double bonds and a leaving group L (B-functional group), characterized in that said single aromatic ring is directly covalently attached to one of the double bonded carbons of the B functional group or to a fused aromatic ring containing two such double bonded carbons of the B-functional group, and one A-functional group of one monomer is capable of reaction under cycloaddition reaction conditions with the B-functional group of a second monomer to thereby form a polymer.
    Type: Grant
    Filed: April 1, 2004
    Date of Patent: June 3, 2008
    Assignee: Dow Global Technologies Inc.
    Inventors: James P. Godschalx, Robert E. Hefner, Jr., Q. Jason Niu, H. Craig Silvis
  • Patent number: 7368483
    Abstract: A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
    Type: Grant
    Filed: April 19, 2004
    Date of Patent: May 6, 2008
    Assignees: International Business Machines Corporation, Dow Global Technologies, Inc.
    Inventors: Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen
  • Patent number: 7109249
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: July 16, 2004
    Date of Patent: September 19, 2006
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Patent number: 6887910
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: May 3, 2005
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu
  • Patent number: 6818285
    Abstract: A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: November 16, 2004
    Assignee: International Business Machines Corporation
    Inventors: Jeffrey C. Hedrick, Muthumanickam Sankarapandian, Christy S. Tyberg, James P. Godschalx, Qingshan J. Niu, Harry C. Silvis
  • Publication number: 20040198850
    Abstract: A low-k organic dielectric material having stable nano-sized porous is provided as well as a method of fabricating the same. The porous low-k organic dielectric material is made from a composition of matter having a vitrification temperature (Tv-comp) which includes a b-staged thermosetting resin having a vitrification temperate (Tv-resin), a pore generating material, and a reactive additive. The reactive additive lowers Tv-comp below Tv-resin.
    Type: Application
    Filed: April 19, 2004
    Publication date: October 7, 2004
    Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, DOW GLOBAL TECHNOLOGIES INC.
    Inventors: Eric Connor, James P. Godschalx, Craig J. Hawker, James L. Hedrick, Victor Yee-Way Lee, Teddie P. Magbitang, Robert D. Miller, Q. Jason Niu, Willi Volksen
  • Patent number: 6790792
    Abstract: A cured polyphenylene polymer having a glass transition temperature no greater than 465° C. An integrated circuit article having a fracture toughness as determined by the modified edge liftoff test of at least 0.3 MPa-m1/2.
    Type: Grant
    Filed: April 29, 2002
    Date of Patent: September 14, 2004
    Assignee: Dow Global Technologies Inc.
    Inventors: Edward O. Shaffer, II, Kevin E. Howard, James P. Godschalx, Paul H. Townsend, III
  • Publication number: 20040126586
    Abstract: A crosslinked polyarylene material with a reduced coefficient of thermal expansion at high temperatures compared with conventional crosslinked polyarylene materials is provided. In addition, an integrated circuit article containing a crosslinked polyarylene polymer with reduced coefficient of thermal expansion at high temperatures is provided.
    Type: Application
    Filed: December 31, 2002
    Publication date: July 1, 2004
    Inventors: Jeffrey C. Hedrick, Muthumanickam Sankarapandian, Christy S. Tyberg, James P. Godschalx, Qingshan J. Niu, Harry C. Silvis
  • Publication number: 20040053033
    Abstract: This invention is a monomer comprising at least two dienophile groups and at least two ring structures which ring structures are characterized by the presence of two conjugated carbon-to-carbon double bonds and the presence of a leaving group L, wherein L is characterized that when the ring structure reacts with a dienophile in the presence of heat or other energy sources, L is removed to form an aromatic ring structure. This invention is also curable oligomers and polymers and highly cross-linked polymers made with such monomers. Moreover, this invention is a method of making porous films by combining such monomers or their oligomers with a porogen, curing the polymer and removing the porogen.
    Type: Application
    Filed: February 12, 2003
    Publication date: March 18, 2004
    Inventors: Q. Jason Niu, Robert E. Hefner, James P. Godschalx, James T. Pechacek, Kim E. Arndt
  • Patent number: 6653358
    Abstract: A suitable cross-linkable matrix precursor and a poragen can be treated to form a porous cross-linked matrix having a Tg of greater than 300° C. The porous matrix material has a lower dielectric constant than the corresponding non-porous matrix material, making the porous matrix material particularly attractive for a variety of electronic applications including integrated circuits, multichip modules, and flat panel display devices.
    Type: Grant
    Filed: October 29, 2002
    Date of Patent: November 25, 2003
    Assignee: Dow Global Technologies Inc.
    Inventors: Kenneth J. Bruza, James P. Godschalx, Edward O. Shaffer, II, Dennis W. Smith, Jr., Paul H. Townsend, III, Kevin J. Bouck, Qing Shan J. Niu