Abstract: A method is provided to replace a damaged pin in a module for an integrated circuit assembly without damaging the circuit device or chip mounted in a circuitized substrate. This method comprises brazing a new pin to the base of the old pin by capacitive discharge brazing with a ribbon of compatible metal foil, requiring no flux, and is effected by firing the charge by completing a circuit which includes a pin attachment tool, the ribbon and the power supply, but in which circuit the chip is bypassed. The arc is struck and the new pin is brazed to the old without generating sufficient heat to damage the chip, and without conducting any current through the chip. The attachment tool is uniquely adapted to clamp the new pin and locate the pin precisely over the base of the old pin.

Abstract: This invention provides a method for expanding at least a portion of a cylindrical sidewall of a generally cylindrically shaped, electrically responsive, metallic body. This method comprises the steps of retaining at least a first portion of the metallic body, disposing a coil of electrically conductive material inside the metallic body, and energizing the coil to create an electromagnetic force sufficient to expand at least a portion of the generally cylindrical sidewalls of the metallic body outwardly of the original generally cylindrical shape. During such expansion, a fluid is introduced between the coil and the inside surfaces of the container to maintain positive gauge pressure as the sidewalls expand. This invention also provides an apparatus for expanding at least a portion of a cylindrical sidewall of a generally cylindrically shaped, electrically responsive, metallic body.

Abstract: A preferably aluminum blind setting rivet including a detachable drill tip, preferably of steel, for self-drilling, the drill tip being attached to the rivet mandrel for drilling a hole to receive the rivet and being subsequently ejected from the mandrel during rivet setting.

Abstract: Means for making electrical contact with a pair of spot welding electrodes and workpieces engaged by the electrodes. The means includes two rigid insulating blocks for mounting on each electrode of an electrode pair. Each block has a first electrical conductor for physically engaging the electrode upon which it is mounted and a second electrical conductor for physically engaging an exposed surface of the workpiece the electrode will engage in a welding process. The electrical conductors extend in a direction substantially perpendicular to the electrodes when the blocks are mounted thereon. In addition, means integral with the blocks and conductors for respectively electrically connecting the conductors to a device for measuring the voltage drop between electrodes and between the exposed surfaces of the workpieces when welding current is applied to the workpieces by the electrodes.