Abstract: A plurality of heat-conducting compressible button contacts (10) between a heatsink (28) and an electronic part, e.g., a printed wiring board (22) or integrated circuit (24), to be cooled. A thin plate (16) and/or indentations (44, 44') in the heatsink are preferably used to support the heat-conducting buttons. Each heat-conducting button contact is placed in compression, generally, for example, by the heatsink. A thermal path is thus provided between the part and the heatsink. Differently sized compressible button contacts are used to accommodate disparate heights between the heat sink and surfaces on components of the electronic part.

Abstract: A package (10, 110, 210, 310) comprises a planar heat exchanger (14, 114, 314) with an air inlet (16, 116, 316) and an air outlet (18, 118, 318) thermally coupled to an electronic module (12). A flexible diaphragm operated pump (20, 120, 220, 320) with one-way valves (132, 134; 232, 234; 332, 334) are disposed between the air inlet and the air outlet. The diaphragm is oscillable to pump air through the heat exchanger from the inlet and out through the outlet. One or more piezo-electric transducers (138, 138; 232, 238; 338) are mounted on a diaphragm (136, 236, 336) and a power source and oscillator (140) are coupled to the transducer(s) to cause the diaphragm to rapidly flex and pump the air. The heat exchanger includes an internal structure (142, 342) defining a multitude of continuous air conducting passages.

Abstract: The environmentally protected module (16, 116, 216), which is qualifiable under military and space specifications, uses commercial and/or industrial grade electronic components (18, 20; 118, 120; 218, 220). The components are secured to and are electrically coupled together on a printed wiring board (24, 124, 224), through which thermally conductive vias (38, 138, 238) extend. The components are encapsulated in a thermally conductive and electrically insulative packaging material (25a, 25b; 125; 225, 229). Cooling or heating is provided by Peltier thermoelectric heat pump devices (32, 132, 232) coupled between an external heat sink/exchanger (35, 80; 135; 235) and the components.