Patents by Inventor James R. Volstorf

James R. Volstorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7059907
    Abstract: A preferred embodiment of a modular electrical connector includes a plug having a printed circuit board, a contact finger positioned on a portion of the printed circuit board, and a housing for supporting and constraining the printed circuit board so that the portion of the printed circuit board extends from the housing. The printed circuit board has a flexible portion that permits the portion of the printed circuit board to translate in relation to the housing. The modular electrical connector also includes a receptacle for mating with the plug and having a first contact for electrically contacting the contact finger when the plug and the receptacle are mated, and a housing having a slot formed therein for receiving the portion of the printed circuit board when the plug and the receptacle are mated.
    Type: Grant
    Filed: July 24, 2003
    Date of Patent: June 13, 2006
    Assignee: FCI Americas Technology, Inc.
    Inventors: Clifford L. Winings, Stuart C. Stoner, Stanley W. Olson, Joseph B. Shuey, Stephen B. Smith, James R. Volstorf
  • Patent number: 6840783
    Abstract: A press-fit bus-bar for distributing power along a backplane or a printed circuit board includes a number of flat bus bar conductors fabricated from an electrically conductive material. Each bus bar conductor is separated from adjacent bus bar conductors by layers of an insulating material. A number of electrically conductive press-fit tails protrude from one edge of each bus bar conductor. When the laminated bus bar conductors and insulating material layers are placed in a housing which is then filled with a hardened epoxy resin, the press-fit tails protrude from the surface of that epoxy resin. These protruding tails can be press-fit in a backplane(s) or printed circuit board(s) for the purpose of supplying these backplane(s) or printed circuit board(s) with electric power.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: January 11, 2005
    Assignee: FCI Americas Technology, Inc.
    Inventors: Gerald Wolford, James Mills, Steven E. Minich, Christopher J. Kolivoski, John D. Dodds, James R. Volstorf, Wilfred J. Swain, James S. Staron
  • Patent number: 6717825
    Abstract: Two connector printed circuit boards with electrical connections are mounted on opposite sides of a mid-plane printed circuit board at angles to each other. Via holes are positioned on the faces of the mid-plane board according to one of two schemes. In the first scheme, the via holes are positioned along an axis perpendicular to an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from a point on the axis that bisects the angle of misalignment of the connector boards. In the second scheme, the via holes are positioned along an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from the electrical connections.
    Type: Grant
    Filed: January 18, 2002
    Date of Patent: April 6, 2004
    Assignee: FCI Americas Technology, Inc.
    Inventor: James R. Volstorf
  • Publication number: 20030137817
    Abstract: An electrical connection system for two printed circuit boards mounted on opposite sides of a mid-plane printed circuit board at angles to each other. The system includes two connector printed circuit boards, each containing pairs of electrical connections. The connector boards are mounted on opposite faces of a mid-plane printed circuit board, which contains pairs of overlaying via holes on each of its faces. The via holes are positioned according to one of two schemes. In the first scheme, the via holes are positioned along an axis perpendicular to an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from a point on the axis that bisects the angle of misalignment of the connector boards. In the second scheme, the via holes are positioned along an axis that bisects the angle of misalignment of the connector boards, and the via holes are equidistant from each of the electrical connections.
    Type: Application
    Filed: January 18, 2002
    Publication date: July 24, 2003
    Inventor: James R. Volstorf
  • Patent number: 6572410
    Abstract: A shield for an electrical connection header is provided. The shield comprises first, second, and third metal shield sections. Each of the first and second shield sections has open slots situated between the shield sections. The first and second sections are located substantially parallel to each other and have their corresponding slots substantially aligned with each other. The third metal shield sections are situated between the first and second sections and have an aperture for receiving a connection pin.
    Type: Grant
    Filed: February 20, 2002
    Date of Patent: June 3, 2003
    Assignee: FCI Americas Technology, Inc.
    Inventors: James R. Volstorf, Johannes Maria Blasius van Woensel
  • Publication number: 20030096520
    Abstract: A press-fit bus-bar for distributing power along a backplane or a printed circuit board comprises a number of flat bus bar conductors fabricated from an electrically conductive material. Each bus bar conductor is separated from adjacent bus bar conductors by layers of an insulating material. A number of electrically conductive press-fit tails protrude from one edge of each bus bar conductor. When the laminated bus bar conductors and insulating material layers are placed in a housing which is then filled with a hardened epoxy resin, the press-fit tails protrude from the surface of that epoxy resin. These protruding tails can be press-fit in a backplane(s) or printed circuit board(s) for the purpose of supplying these backplane(s) or printed circuit board(s) with electric power.
    Type: Application
    Filed: September 11, 2002
    Publication date: May 22, 2003
    Inventors: Gerald Wolford, James Mills, Steven E. Minich, Christopher J. Kolivoski, John D. Dodds, James R. Volstorf, Wilfred J. Swain, James S. Staron
  • Patent number: 6565388
    Abstract: A shielded cable connector (20) which minimizes EMI and crosstalk between closely situated assembly modules is disclosed. The shielded cable connector comprises a connecting latch (28). The shielded cable connector facilitates insertion of the shielding housing (20) into a shielded header connector (24), and prevents inadvertent removal of the shielding housing (20) from the shielded header (24).
    Type: Grant
    Filed: December 22, 2000
    Date of Patent: May 20, 2003
    Assignee: FCI Americas Technology, Inc.
    Inventors: Johannes M. B. Van Woensel, James R. Volstorf
  • Patent number: 6434820
    Abstract: Disclosed is a method for manufacturing an insulation displacement contact dimple comprising the steps of. (a) positioning a metal element between a first concave upper die and a first convex lower die having a radius to form a dimple shape in the medial element; (b) positioning the dimple shaped metal element formed in step (a) between a second concave upper die and second convex lower die having a radius smaller than the radius of the first convex lower die to reform the dimple shaped metal element formed in step (a); and (c) positioning the dimple shaped metal element formed in step (b) between a third concave upper die and a third convex lower die having a radius larger than the radius of the second convex lower die. A contact dimple manufactured by the method is also disclosed.
    Type: Grant
    Filed: October 5, 1999
    Date of Patent: August 20, 2002
    Assignee: FCI Americas Technology, Inc.
    Inventor: James R. Volstorf
  • Publication number: 20020088118
    Abstract: Disclosed is a method for manufacturing an insulation displacement contact dimple comprising the steps of. (a) positioning a metal element between a first concave upper die and a first convex lower die having a radius to form a dimple shape in the medial element; (b) positioning the dimple shaped metal element formed in step (a) between a second concave upper die and second convex lower die having a radius smaller than the radius of the first convex lower die to reform the dimple shaped metal element formed in step (a); and (c) positioning the dimple shaped metal element formed in step (b) between a third concave upper die and a third convex lower die having a radius larger than the radius of the second convex lower die. A contact dimple manufactured by the method is also disclosed.
    Type: Application
    Filed: October 5, 1999
    Publication date: July 11, 2002
    Inventor: JAMES R. VOLSTORF
  • Patent number: 6021568
    Abstract: Disclosed is a method for manufacturing an insulation displacement contact dimple comprising the steps of. (a) positioning a metal element between a first concave upper die and a first convex lower die having a radius to form a dimple shape in the medial element; (b) positioning the dimple shaped metal element formed in step (a) between a second concave upper die and second convex lower die having a radius smaller than the radius of the first convex lower die to reform the dimple shaped metal element formed in step (a); and (c) positioning the dimple shaped metal element formed in step (b) between a third concave upper die and a third convex lower die having a radius larger than the radius of the second convex lower die. A contact dimple manufactured by the method is also disclosed.
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: February 8, 2000
    Inventor: James R. Volstorf
  • Patent number: 6012942
    Abstract: Disclosed is a method for manufacturing an insulation displacement contact dimple comprising the steps of: (a) positioning a metal element between a first concave upper die and a first convex lower die having a radius to form a dimple shape in the medial element; (b) positioning the dimple shaped metal element formed in step (a) between a second concave upper die and second convex lower die having a radius smaller than the radius of the first convex lower die to reform the dimple shaped metal element formed in step (a); and (c) positioning the dimple shaped metal element formed in step (b) between a third concave upper die and a third convex lower die having a radius larger than the radius of the second convex lower die. A contact dimple manufactured by the method is also disclosed.
    Type: Grant
    Filed: September 30, 1997
    Date of Patent: January 11, 2000
    Inventor: James R. Volstorf
  • Patent number: 5522731
    Abstract: Proposed is a connector assembly for electrically coupling a shielded cable to a ground plane. The assembly includes a metal shroud with pins for press-fitting to the ground plane, and a plug with a shield connection clamped or taped to the cable shield. Ground connections are provided by two paths: one from the drain wire of the cable through a signal contact in the plug and the other through the shield connection and shroud. Spacers in the shroud provide a keying function while permitting end-to-end stacking of plugs. Latching features on the plug and shroud hold the plugs in position and prevent insertion of the plug in the wrong orientation. Heat stakes in the plug can be used for the latching feature.
    Type: Grant
    Filed: May 13, 1994
    Date of Patent: June 4, 1996
    Assignee: Berg Technology, Inc.
    Inventors: William C. Clark, James R. Volstorf, Clifford L. Winings