Abstract: This invention relates to curable strippable adhesive and coating films, and also to improved high performance pressure sensitive adhesives. The adhesive comprises: (a) from 10 to 90 percent by weight of a crosslinkable epoxidized diene polymer, (b) from 0 to 70 percent by weight of a diene mono-ol polymer, with the condition that the mono-ol polymer not exceed three times the weight of the epoxidized polymer, (c) from 5 to 40 weight percent of a block copolymer of a vinyl aromatic hydrocarbon and a diene having, on average, more than one vinyl aromatic hydrocarbon block per molecule, and wherein the block copolymer can be functionalized by grafting onto it from 0.1 to 5% by weight of a carboxylic acid or anhydride, preferably maleic anhydride, (d) from 0 to 65% percent by weight of a tackifying resin, and (e) from 0.01 to 3 percent by weight of a photoinitiator.

Abstract: The invention herein relates to unsaturated monohydroxylated polydiene polymers which are comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation. The invention also encompasses partially hydrogenated and/or epoxidized derivatives of these novel monohydroxylated polydiene polymers. The preferred monohydroxylated polydiene polymer of the present invention has a structural formula (HO)x—A—Sz—B—(OH)y wherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers, or copolymer blocks of diolefin monomers and monoalkenyl aromatic hydrocarbon monomers. These polymers may contain up to 60% by weight of at least one vinyl aromatic hydrocarbon, preferably styrene.

Abstract: An epoxidized low viscosity polydiene polymer which has the structural formula

Abstract: A crosslinkable composition comprising from 50 to 98 percent by weight of an epoxidized monohydroxylated polydiene polymer which is comprised of at least two polymerizable ethenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation which is suitable for epoxidation, and from 50 to 2 percent by weight of an amino resin.

Abstract: A crosslinkable waterborne dispersion of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% w of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% w of a compatible aminoplast, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.

Abstract: A crosslinkble waterborne dispersion useful as a coating on metal substrates of an epoxidized polydiene block polymer composition which comprises: (a) 10 to 65% by weight of a polydiene block polymer containing at least five olefinic epoxy groups per molecule which are sterically hindered, (b) 0.2 to 25% by weight of a compatible aminoplast, (c) 0.1 to 10% by weight of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. A water-continuous process and an inversion process for making a dispersion are also described.

Abstract: It has been surprisingly found that certain properties including adhesion strength to smooth surfaces may be improved by making hot melt adhesives from blends comprising a poly-1-butene polymer, a tackifier resin, and from 3 wt. % to 25 wt. % of a liquid or semi-liquid, hydrogenated or partially hydrogenated low molecular weight conjugated diene polymer prepared by anionic polymerization.

Abstract: A pressure structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a glycidyl ether-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functonalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with glycidyl ether and another functionality such as olefinic unsaturation or epoxidized olefin; and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as an aliphatic polyamine, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer but does not cure under conditions required to cure the telechelic polymer, such as a sulfur-based curing agent when the functionality is olefinic unsaturation or an amino resin when the functionality is epoxidized olefin.

Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality.

Abstract: A pressure sensitive structural or sealant composition comprises (a) from 15 to 95% by weight of a telechelic polymer such as a hydroxyl-functional telechelic polymer and from 5 to 85% by weight of a heterotelechelic polydiene block polymer wherein at least one of the functionalities is the same as the functionality of the telechelic polymer, such as a heterotelechelic polydiene block polymer with hydroxyl and glycidyl ether funciontialities, and (b) a dual curing system wherein one curing agent cures the teolechelic polymer and the common functionality on the heterotelechelic polydiene block polymer such as a polyisocyanate, and the other curing agent cures the other functionality on the heterotelechelic polydiene block polymer at higher temperatures but does not cure under conditions required to cure the telechelic polymer, such as a polycarboxylic acid, polycarboxylic acid anhydride or a catalyst.

Abstract: A pressure sensitive structural adhesive or sealant composition comprises a) a polymer system containing from 95 to 15 percent by weight of a telechelic polymer such as a polyhydroxylated diene block polymer and from 5 to 85 percent by weight of a heterotelechelic polymer such as an epoxidized monohydroxylated diene block polymer, and b) a dual curing system wherein one element such as a polyisocyanate cures the telechelic polymer at ambient temperature, and the other element such as an amino resin cures the heterotelechelic polymer.

Abstract: A crosslinkable waterborne dispersion of a hydroxy functional polydiene polymer composition which comprises: (a) 10 to 65% w of a hydroxy functional polydiene polymer, (b) 0.2 to 25% w of a compatible amino resin, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.

Abstract: The invention herein is curable adhesive and sealant compositions and a non-aqueous solvent free process for producing such compositions which comprise a mono-ol, tackifying resin, and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethylenically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components together with a photoinitiator which is selected from the group consisting of diaryl, especially diaryliodonium, salts characterized by the general formula: ##STR1## where Y is ##STR2## where R is hydrogen, aryl, alkyl, or an alkylhalide; n is an integer of at least 1, Z is I, Cl, or Br, preferably I, and X is a complex metal halide anion or a complex halide anion of a strong protonic acid.

Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality.

Abstract: The invention herein is a non-aqueous solvent free process for producing UV curable adhesive and sealant compositions comprising a tackifying resin and a monohydroxylated epoxidized polydiene polymer which is comprised of at least two polymerizable ethnically unsaturated hydrocarbon monomers wherein at least one is a diene monomer which yields unsaturation suitable for epoxidation and wherein the polymer contains from 0.1 to 7.0 milliequivalents of epoxy per gram of polymer. The process involves mixing the components with an insoluble photoinitiator under conditions of high shear and/or cavitation. The invention also relates to a film of 5 mils to one inch thick which is formed from the composition made according to the process above.

Abstract: Pressure sensitive structural adhesive and sealant compositions comprising: (a) a polymer system comprising from 95 to 15 percent by weight of a telechelic polymer and from 5 to 85 percent by weight of a heterotelechelic polymer wherein at least one of the functionalities thereon is the same as the functionality on the telechelic polymer, and (b) a dual curing system wherein one element of the curing system cures the telechelic polymer and the common functionality on the heterotelechelic polymer and the other element cures the functionality on the heterotelechelic polymer but does not cure under the conditions required to cure the telechelic polymer to form a structural adhesive or sealant composition. In a preferred embodiment, the polymer system is comprised of a hydroxyl functional telechelic diol or polyol polymer and the heterotelechelic polymer is a monohydroxylated polydiene polymer which also has epoxidized olefin functionality.

Abstract: A crosslinkable waterborne dispersion of a hydroxy functional polydiene polymer composition which comprises: (a) 10 to 65% w of a hydroxy functional polydiene polymer, (b) 0.2 to 25% w of a compatible amino resin, (c) 0.1 to 10% w of a surfactant which is nonionic or anionic and has a volatile cation, and (d) the balance water. The invention also describes a water-continuous process and an inversion processes for making such dispersions.

Abstract: A process for incorporation of epoxidized polydienes into aromatic epoxy resins which comprises (a) blending the epoxidized polydiene into a curing agent in a ratio of 1:20 to 1:4, (b) reacting the epoxidized polydiene and a curing agent at a temperature of from 100.degree. to 150.degree. C. over a time from 10 to 100 minutes, (c) mixing the pre-reacted epoxidized polydiene and curing agent with the aromatic epoxy resin and accelerator, and (d) curing the aromatic epoxy resin by heating the full mixture of paragraph (c) to a temperature of from 110.degree. to 170.degree. C. for from 2 to 6 hours.

Abstract: A viscous block copolymer of the formula(A-B-A.sub.p).sub.n -Y.sub.r -(A.sub.q -B).sub.mwherein Y is a coupling agent or coupling monomers, andwherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers or copolymer blocks of conjugated diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, andwherein the A blocks have a higher number of more highly substituted aliphatic double bonds per unit of block mass than do the B blocks, andwherein the A blocks have a molecular weight from about 100 to about 3000 and the B blocks have a molecular weight from about 1000 to about 15,000, andwherein p and q are 0 or 1 and n>0, r is 0 or 1, m.gtoreq.0 and n+m ranges from 1 to 100.This block copolymer is preferably partially hydrogenated, epoxidized and crosslinked through at least some of the epoxy functionality to form an adhesive, coating or sealant composition.

Abstract: In a process of curing epoxidized polymers of conjugated dienes which contain aromatic moieties by exposing the polymers to ultraviolet radiation in the presence of a photoinitiator, the improvement which comprises reducing the amount of irradiation necessary to achieve an effective cure by adding a small but effective amount of a photosensitizer which absorbs UV radiation in a wavelength range which is not obscured by the polymer to the polymer prior to or during irradiation.