Abstract: A map image is displayed via a user interface. A user selection of a location marker or one of a set of textual driving directions is received via the user interface. In response to the received user selection, an interactive information window overlaid within the map image is generated. Generating the interactive information window includes providing additional information regarding a location related to the marker or to the one of the set of textual driving directions.

Abstract: An apparatus and a method of mounting an array of different heatsinks to a closely packed array of processors, cache controller devices, and any other type of data processing element utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the comers where the devices are attached to the printed circuit board.

Abstract: A circuit board guidance device is arranged to have a circuit board such as a PCI I/O board 205 inserted therein for connection into an electrical socket or connector 203 located on a system motherboard 201. The guidance device includes a guidance mechanism which translates an insertion force applied in one direction into a connecting force effective to move the circuit board in a second direction. The guidance device is effective to aid in locating the circuit board 205 above connector 203 on the system motherboard 201, and also to aid in forcing the desired electrical connection between corresponding connectors on the circuit board 205 and a system motherboard 201. The guidance device is also effective in aiding in the extraction of the circuit board from its connection to the motherboard connector 203. An I/O bracket 261 is implemented to provide EMI grounding to the system bulkhead.

Abstract: An apparatus and method therefore mount an array of different heatsinks to a closely packed array of data processing elements utilized within a data processing system. The apparatus includes a metal frame with multiple apertures in the bottom to allow access to the tops of the devices for which heatsinks will be provided. The metal frame has multiple apertures that allow access to the tops of the data processing elements underneath. The metal frame serves as a containment vehicle for multiple heatsinks, and also provides rigidity to the printed circuit board in the particularly vulnerable vicinity of the corners where the devices are attached to the printed circuit board.