Abstract: Systems and methods for reading a RFID-tag signal in the presence of noise and other propagation and circuit impairments using a RFID-tag reader are disclosed. The method includes receiving with a RFID-tag reader multiple copies of an original RFID-tag signal from a RFID tag. The original RFID-tag signal comprises an original bit sequence representative of information stored in the RFID tag. At least some of the received RFID-tag signal copies differ from one another due to noise or other signal impairments. The received multiple copies are processed on a sample-by-sample basis in the RFID-tag reader using digital signal processing techniques to obtain an improved received digitized RFID tag signal that substantially removes the noise and other impairments. This improved signal is used to recover the original bit sequence and thus the information stored in the RFID tag.

Abstract: There is provided a passive RFID transponder assembly that includes a condition responsive device adapted to read a condition relating to the component that is associated with the RFID transponder assembly. The condition that is read by the condition responsive device relates to physical contact with a field technician or a mating component, relates to electrical connection between an integrated circuit chip and an antenna, relates to one or more environmental conditions, or the like. The components with which the RFID transponder assemblies are associated include components of telecommunications equipment, such as fiber optic connectors, fiber optic adapters, fiber optic patch panels, copper connectors, and copper adapters to list some non-limiting examples.

Abstract: There is provided a system for identifying a plurality of components via an RFID reader with an associated database and processing element. The system includes a first component with an associated first RFID transponder and a second component with an associated second RFID transponder. A third RFID transponder may be associated with the first component, wherein either the first or third RFID transponder includes stored information relating to both transponders. The first and second RFID transponders are adapted to communicate with the RFID reader to enable identification of the connection of the first component to the second component. One of the RFID transponders may be adapted to identify the other RFID transponder and store the identification information for subsequent communication to the RFID reader of identification information for both RFID transponders and the associated components. The system is adapted to create a map of the two or more components, such as components of telecommunications equipment.

Abstract: There is provided a system for identifying a connection of two or more components in which one or more RFID transponders are associated with the two or more components. A plug is associated with the first component, such as a fiber optic connector, and a socket is associated with the second component, such as a fiber optic adapter. An RFID transponder is associated with each component and at least one of the RFID transponders is activatable when the plug is received by the socket to enable the activated RFID transponder to communicate with the RFID reader. The antennas and integrated circuit chips that define the RFID transponders are positioned relative to the plug and socket to enable the one or more RFID transponders to activate when the plug is received by the socket. In addition, the RFID transponders may communicate with one another to identify other RFID transponders in order to communicate identities of two or more RFID transponders.

Abstract: A light emitting device (e.g., organic light emitting diode (OLED)) and a method for manufacturing the OLED are described herein. Basically, the OLED includes a substrate, a first conductive electrode, at least one organic layer, a second conductive electrode, an encapsulant substrate and a microstructure. The microstructure has internal refractive index variations or internal or surface physical variations that function to perturb the propagation of internal waveguide modes within the OLED and as a result allows more light to be emitted from the OLED. Several different embodiments of the microstructure that can be incorporated within an OLED are described herein.

Abstract: Articles and methods for securing or aligning objects on substrates are disclosed. The articles and methods include a gripping element disposed on a substrate that includes a groove and flexible gripping elements. The articles and methods are particularly useful for securing optical fibers in arrays and manufacturing optical devices.

Abstract: Articles and methods for forming two-dimensional arrays of optical elements are disclosed. The articles and methods include providing an alignment substrate having apertures having the inner periphery of the apertures filled with a flexible gripper to provide an opening sized to grip an optical fiber. The articles and methods are useful for making arrays of optical elements including optical fibers and manufacturing optical devices.

Abstract: Articles and methods for securing or aligning objects on substrates are disclosed. The articles and methods include a gripping element disposed on a substrate that includes a groove and flexible gripping elements. The articles and methods are particularly useful for securing optical fibers in arrays and manufacturing optical devices.

Abstract: Packaging of micromechanical and microelectromechanical devices is carried out by mechanical couplers for connecting pairs or arrays of optical fibers in end-to-end alignment. In another embodiment, a coupler interconnects one or more optical components on a substrate. The electrical components may be active elements such as light sources or light sensors, while the optical components may be waveguides. The fibers are secured in a coupler block, and a substrate carrying the light detector or light source is mounted on or in the block and is secured in alignment with the fibers. The fibers are removably secured within the block by spring fingers.

Abstract: Packaging of micromechanical and microelectromechanical devices is carried out by mechanical couplers for connecting pairs or arrays of optical fibers in end-to-end alignment. In another embodiment, a coupler interconnects one or more optical components on a substrate. The electrical components may be active elements such as light sources or light sensors, while the optical components may be waveguides. The fibers are secured in a coupler block, and a substrate carrying the light detector or light source is mounted on or in the block and is secured in alignment with the fibers. The fibers are removably secured within the block by spring fingers. The coupler block may include electrical circuitry connectable to the sensors or light sources on the substrate mounted on the block through wire bonding techniques.