Abstract: An apparatus includes a coldplate and a bus bar. The coldplate is configured to be thermally coupled to a structure to be cooled and to remove thermal energy from the structure. The bus bar is integrated into the coldplate and is configured to deliver power to multiple components of the structure. The apparatus may also include multiple mounting holes positioned in rows on the coldplate and configured to mechanically couple the structure to the coldplate, where one of the bus bar or an additional bus bar is integrated between each pair of adjacent rows of mounting holes. The apparatus may further include sealed cooling channels adjacent to the bus bar and each additional bus bar. The bus bar may be integrated into the coldplate using vacuum brazing or ultrasonic additive manufacturing.

Abstract: A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

Abstract: An apparatus includes a heat sink configured to receive thermal energy from one or more heat sources. The heat sink includes a local reservoir configured to hold a liquid coolant, and the heat sink is configured to pass the thermal energy into the liquid coolant in the local reservoir in order to vaporize at least some of the liquid coolant. The apparatus also includes a membrane configured to allow vaporized coolant to pass through the membrane out of the local reservoir into an ambient environment and to prevent unvaporized coolant from passing through the membrane. The membrane is thereby configured to provide passive flow control for the liquid coolant. The membrane could include a vapor-permeable and liquid-repelling membrane. The membrane can also be configured to hold the liquid coolant in the local reservoir against one or more surfaces of the heat sink.

Abstract: A multi-layer ceramic module is provided that includes an integrated temperature control and a power switch. The integrated temperature control is configured to dissipate thermal energy. The power switch is configured to couple a power source for a standard component of the multi-layer ceramic module to the integrated temperature control.

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract: In one embodiment, a hermetic covering system includes a projectile and at least one bag. The projectile has a body and a component that houses moisture-sensitive equipment. The at least one bag may be coupled to the body such that the projectile protrudes through the opening and the component is disposed in the inner cavity to protect the component during storage of the projectile.

Abstract: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Abstract: Aspects of embodiments according to the present invention are directed toward a circuitry and a method to accurately measure the junction temperature of power amplifier and uses the measurement to enable optimization of performance in the presence of a mismatched load via control of the power amplifier such that corrective action to mitigate effects of the mismatched load can be performed.

Abstract: According to one embodiment, an antenna apparatus includes first and second antenna arrays configured in a support structure. Each antenna array has multiple antenna elements that transmit and/or receive electro-magnetic radiation. The elements of the first antenna array are oriented in a boresight direction that is different from the boresight direction in which the elements of the second antenna array are oriented. A plurality of switches alternatively couples the first antenna elements or the second antenna elements to a signal distribution circuit.

Abstract: Aspects of embodiments according to the present invention are directed toward a circuitry and a method to accurately measure the junction temperature of power amplifier and uses the measurement to enable optimization of performance in the presence of a mismatched load via control of the power amplifier such that corrective action to mitigate effects of the mismatched load can be performed.

Abstract: A multi-band electronically scanned array antenna including a first sub-assembly having electronic circuits for a first frequency band; a second sub-assembly mechanically coupled to the first sub-assembly and having electronic circuits for a second frequency band; and an aperture adjacent to the first sub-assembly, the aperture being shared by the first sub-assembly and the second sub-assembly. The array antenna may further include a band switching circuit, or a combining circuit for coupling the first sub-assembly or the second sub-assembly to the aperture. The array antenna may also include a third sub-assembly including electronic circuits for a third frequency band. In this way, the aperture is shared by the first sub-assembly, the second sub-assembly, and the third sub-assembly to provide a smaller and lighter array antenna.

Abstract: According to one embodiment, an antenna apparatus includes first and second antenna arrays configured in a support structure. Each antenna array has multiple antenna elements that transmit and/or receive electro-magnetic radiation. The elements of the first antenna array are oriented in a boresight direction that is different from the boresight direction in which the elements of the second antenna array are oriented. A plurality of switches alternatively couples the first antenna elements or the second antenna elements to a signal distribution circuit.

Abstract: According to an embodiment of the present invention, a thermal management system for electronic components includes a plurality of spacers disposed between a first flexible substrate and a second flexible substrate to form a plurality of heat transfer regions each having a plurality of capillary pumping regions, a two-phase fluid disposed between at least one pair of adjacent spacers, and a plurality of electronic components coupled to a mounting surface of the first flexible substrate.

Abstract: According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of radiating elements receive or transmit electromagnetic energy. The cooling channels are formed by an internal surface of the radiating elements. The fluid inlet and the fluid outlet are in communication with each of the cooling channels. Each of the cooling channels provides a heat exchanging function by receiving at least a portion of a fluid coolant from the fluid inlet, transferring a least a portion of the thermal energy from the respective radiating element to the received portion of the fluid coolant, and dispensing of at least a portion of the received fluid coolant out of the cooling channel to the fluid outlet.

Abstract: According to one embodiment of the disclosure, an integrated antenna structure comprises a plurality of radiating elements, cooling channels embedded directly within each of the plurality of radiating elements, a fluid inlet, and a fluid outlet. Each of the plurality of radiating elements receive or transmit electromagnetic energy. The cooling channels are formed by an internal surface of the radiating elements. The fluid inlet and the fluid outlet are in communication with each of the cooling channels. Each of the cooling channels provides a heat exchanging function by receiving at least a portion of a fluid coolant from the fluid inlet, transferring a least a portion of the thermal energy from the respective radiating element to the received portion of the fluid coolant, and dispensing of at least a portion of the received fluid coolant out of the cooling channel to the fluid outlet.

Abstract: In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

Abstract: Adjusting a calibrated phased array includes receiving conditions data describing conditions at a phased array. The phased array comprises antenna element sets, where an antenna element set comprises antenna elements and is associated with a calibration value. The following is performed for each antenna element set. A temperature value is established for an antenna element set according to the conditions data. A temperature-dependent correction value corresponding to the temperature value is established. A correction value is determined for the antenna element set according to the temperature-dependent correction value and the calibration value associated with the each antenna element set. At least one antenna element of the antenna element set is adjusted according to the correction value.