Patents by Inventor James Sabatini
James Sabatini has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11309304Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: April 18, 2018Date of Patent: April 19, 2022Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20180271372Abstract: An ultrasound probe configured for use in a multi-modality imaging system includes a body including one or more electrical components of the ultrasound probe, an outermost housing enclosing the ultrasound probe, and an electromagnetic interference (EMI) shield disposed between the body and the housing, wherein the EMI shield is configured to reduce interference between the ultrasound probe and one or more different imaging systems of the multi-modality imaging system. The ultrasound probe further includes a transducer disposed on a patient-facing surface of the ultrasound probe and a cable coupled to the body and configured to communicatively couple the ultrasound probe to an ultrasound imaging system of the multi-modality imaging system, wherein the ultrasound probe comprises substantially non-ferromagnetic material.Type: ApplicationFiled: February 15, 2018Publication date: September 27, 2018Inventors: Warren Lee, Eric William Fiveland, David Andrew Shoudy, Timothy Fiorillo, Kwok Pong Chan, Lowell Scott Smith, James Sabatini, David Martin Mills, Thomas Kwok-Fah Foo
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Publication number: 20180240789Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: April 18, 2018Publication date: August 23, 2018Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 10014286Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: May 8, 2009Date of Patent: July 3, 2018Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 9299661Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side. The package also includes a die having an active surface affixed to a contact location of the first side of the dielectric film. A die stud is affixed to the active surface of the die and extends through the dielectric film to an interconnect location of the second side of the dielectric film.Type: GrantFiled: May 18, 2009Date of Patent: March 29, 2016Assignee: General Electric CompanyInventors: Christopher James Kapusta, James Sabatini
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Patent number: 9024447Abstract: An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.Type: GrantFiled: March 13, 2012Date of Patent: May 5, 2015Assignee: General Electric CompanyInventors: Christopher James Kapusta, James Sabatini
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Patent number: 8940582Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: August 19, 2013Date of Patent: January 27, 2015Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20130344653Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: August 19, 2013Publication date: December 26, 2013Applicant: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 8536700Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: May 5, 2011Date of Patent: September 17, 2013Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20120171816Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.Type: ApplicationFiled: December 15, 2011Publication date: July 5, 2012Inventors: Christopher James Kapusta, Glenn Forman, James Sabatini
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Publication number: 20120168941Abstract: An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.Type: ApplicationFiled: March 13, 2012Publication date: July 5, 2012Inventors: Christopher James Kapusta, James Sabatini
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Patent number: 8163596Abstract: An apparatus comprises a first chip layer comprising a first component coupled to a first side of a first flex layer, the first component comprising a plurality of electrical pads. The first chip layer also comprises a first plurality of feed-thru pads coupled to the first side of the first flex layer and a first encapsulant encapsulating the first component, the first encapsulant having a portion thereof removed to form a first plurality of cavities in the first encapsulant and to expose the first plurality of feed-thru pads by way of the first plurality of cavities.Type: GrantFiled: March 24, 2009Date of Patent: April 24, 2012Assignee: General Electric CompanyInventors: Christopher James Kapusta, James Sabatini
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Patent number: 8101590Abstract: This invention provides compounds of Formula I having the structure where R1, R2, R3 and A are defined in the specification or a pharmaceutically acceptable salt thereof useful as antibacterial agents. Compounds according to Formula (II): where Q, R4, R5, R6 and R10 and A are defined in the specification are useful as chemical intermediates.Type: GrantFiled: August 31, 2006Date of Patent: January 24, 2012Assignee: Wyeth LLCInventors: Phaik-Eng Sum, Tarek Suhayl Mansour, David Brian How, Darrin William Hopper, Matthew Douglas Vera, Joshua James Sabatini, Jaechul Shim
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Patent number: 8026608Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: March 24, 2009Date of Patent: September 27, 2011Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Publication number: 20110210440Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: ApplicationFiled: May 5, 2011Publication date: September 1, 2011Inventors: James Sabatini, Christopher James Kapusta, Glenn Forman
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Patent number: 7998965Abstract: The present invention relates to modulators of metalloproteinase activity.Type: GrantFiled: May 14, 2009Date of Patent: August 16, 2011Assignee: Wyeth LLCInventors: Phaik-Eng Sum, Jerauld Stanley Skotnicki, Steve Yik-Kai Tam, Tarek Suhayl Mansour, David Brian How, Joshua James Sabatini, Jason Shaoyun Xiang, Eric Feyfant
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Publication number: 20110156261Abstract: An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film.Type: ApplicationFiled: March 24, 2009Publication date: June 30, 2011Inventors: Christopher James Kapusta, Glenn Forman, James Sabatini
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Patent number: 7947712Abstract: The present invention relates to 8-Hydroxyquinoline Compounds; compositions comprising an 8-Hydroxyquinoline Compound; and methods for treating or preventing a metalloproteinase-related disorder, such as, an arthritic disorder, osteoarthritis, malignant neoplasm, rheumatoid arthritis, asthma, chronic obstructive pulmonary disease, atherosclerosis, age-related macular degeneration, myocardial infarction, a corneal ulceration, an ocular surface disease, hepatitis, an aortic aneurysm, tendonitis, a central nervous system disorder, abnormal wound healing, angiogenesis, restenosis, cirrhosis, multiple sclerosis, glomerulonephritis, graft versus host disease, diabetes, an inflammatory bowel disease, shock, invertebral disc degeneration, stroke, osteopenia or a periodontal disease or comprising administering an effective dose of an 8-Hydroxyquinoline Compound to a mammal in need thereof.Type: GrantFiled: August 23, 2007Date of Patent: May 24, 2011Assignee: Wyeth LLCInventors: Matthew G. Bursavich, Sabrina Lombardi, Adam M. Gilbert, Leif Mark Laakso, Gulnaz Khafizova, David Brian How, Joshua James Sabatini, Phaik-Eng Sum, Jeremy Clemens
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Patent number: 7923446Abstract: The present invention relates to biaryl sulfonamides and their use as, for example, metalloproteinase inhibitors.Type: GrantFiled: May 31, 2007Date of Patent: April 12, 2011Assignee: Wyeth LLCInventors: Jason Shaoyun Xiang, Steve Yikkai Tam, Yonghan Hu, Phaik-Eng Sum, David Brian How, Darrin William Hopper, Matthew Douglas Vera, Joshua James Sabatini, Thomas Saltmarsh Rush, III, Elisabeth Ann Morris, Katy Evangelia Georgiadis
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Patent number: RE47651Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.Type: GrantFiled: January 25, 2017Date of Patent: October 15, 2019Assignee: General Electric CompanyInventors: James Sabatini, Christopher James Kapusta, Glenn Forman